Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009353 | Optical device package with compatible lid and carrier | Tsung-Yueh Tsai, Meng-Jen Wang, Meng-Jung Chuang | 2024-06-11 |
| 11302682 | Optical device package | Tsung-Yueh Tsai, Meng-Jen Wang, Meng-Jung Chuang | 2022-04-12 |
| 11042630 | Dynamic page similarity measurement | Chao-Yu Chen, Peng-Shih Pu | 2021-06-22 |
| 10951636 | Dynamic phishing detection methods and apparatus | Ming-Tai Chang | 2021-03-16 |
| 9059379 | Light-emitting semiconductor packages and related methods | Yen-Ting Kuo, Ping Hu | 2015-06-16 |
| 8994156 | Semiconductor device packages with solder joint enhancement elements | Po-Shing Chiang, Ping Hu | 2015-03-31 |
| 8674487 | Semiconductor packages with lead extensions and related methods | Lin-Wang Yu, Ping Hu, Che-Chin Chang | 2014-03-18 |
| 8502363 | Semiconductor device packages with solder joint enhancement element and related methods | Po-Shing Chiang, Ping Hu | 2013-08-06 |
| 7291926 | Multi-chip package structure | Su Tao | 2007-11-06 |
| 7253529 | Multi-chip package structure | Su Tao | 2007-08-07 |
| 7129583 | Multi-chip package structure | Su Tao | 2006-10-31 |
| 7037750 | Method for manufacturing a package | Chin-Hsien Lin, Tsung-Yueh Tsai | 2006-05-02 |
| 7026709 | Stacked chip-packaging structure | Jung-Kun Kang, Tsung-Yueh Tsai | 2006-04-11 |
| 7015065 | Manufacturing method of ball grid array package | Jung-Kun Kang, Tsung-Yueh Tsai | 2006-03-21 |
| 6564449 | Method of making wire connection in semiconductor device | Jian Chen, Min-Lung Huang | 2003-05-20 |
| 6244499 | Structure of a ball bump for wire bonding and the formation thereof | Jaw-Shiun Hsieh | 2001-06-12 |
| 6195258 | Thermal board used for bonding wires in semiconductor manufacturing process | Chin-Chen Wang | 2001-02-27 |
| 6176416 | Method of making low-profile wire connection | Su Tao | 2001-01-23 |
| 6176417 | Ball bonding method on a chip | Su Tao, Simon Lee, Tao-Yu Chen | 2001-01-23 |
| 6161753 | Method of making a low-profile wire connection for stacked dies | Sung-Fei Wang, Su Tao, Meng-Hui Lin | 2000-12-19 |