Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336149 | Heat sink and communication device | Yu Zhang, Lei Li, Dong Wang | 2025-06-17 |
| 12272671 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou | 2025-04-08 |
| 12207447 | Heat sink and communication device | Yuping Hong, Xiaowei Hui | 2025-01-21 |
| 12101621 | Multimedia information processing method and apparatus, and storage medium | Fan Fan, Jiang Li, Ruihua Li, Lelin Wang, Shuo Li +2 more | 2024-09-24 |
| 12068259 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Hung Chen Kuo, Wen Jin Huang | 2024-08-20 |
| 12057129 | Audio coding method and apparatus | Zhuo Wang, Fan Fan | 2024-08-06 |
| 12009353 | Optical device package with compatible lid and carrier | Tsung-Yueh Tsai, Yu-Fang Tsai, Meng-Jung Chuang | 2024-06-11 |
| 12009313 | Semiconductor package shielding structure | Chien-Yuan Tseng, Hung Chen Kuo, Ying WEI, Chia-Feng Hsu, Yuan-Long Chiao | 2024-06-11 |
| 11941323 | Meme creation method and apparatus | Zhuo Wang, Fan Fan, Lelin Wang | 2024-03-26 |
| 11906638 | High-accuracy satellite positioning method, positioning terminal, and positioning system | Hui Li, Yi Zhang, Fuxiang Xiong | 2024-02-20 |
| 11887967 | Semiconductor device package and method of manufacturing the same | Shang-Ruei Wu, Chien-Yuan Tseng, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li +3 more | 2024-01-30 |
| 11682653 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou | 2023-06-20 |
| 11626525 | Package structure and method for manufacturing the same | Chun Yu KO, Tsu-Hsiu Wu | 2023-04-11 |
| 11605598 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Hung Chen Kuo, Wen Jin Huang | 2023-03-14 |
| 11302682 | Optical device package | Tsung-Yueh Tsai, Yu-Fang Tsai, Meng-Jung Chuang | 2022-04-12 |
| 11221733 | Application control method, graphical user interface, and terminal | Changkuan Chen, Guangyuan Gao | 2022-01-11 |
| 11139274 | Semiconductor device package and method of manufacturing the same | Shang-Ruei Wu, Chien-Yuan Tseng, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li +3 more | 2021-10-05 |
| 10937761 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou | 2021-03-02 |
| 10545581 | Semiconductor package device | Jen-Kai Ou, Tsung-Yueh Tsai, Chih-Ming Hung | 2020-01-28 |
| 10522505 | Semiconductor device package and method for manufacturing the same | Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou | 2019-12-31 |
| 10242940 | Fan-out ball grid array package structure and process for manufacturing the same | Jung-Liang YEH, Tsung-Yueh Tsai, Chih-Ming Hung | 2019-03-26 |
| 10083888 | Semiconductor device package | Chi-Tsung Chiu, Cheng-Hsi CHUANG, Hui-Ying Hsieh, Hui Hua LEE | 2018-09-25 |
| 9099528 | Method for manufacturing three-dimensional integrated circuit | Dongsheng Liu | 2015-08-04 |
| 8937015 | Method for forming vias in a substrate | Chung-Hsi Wu | 2015-01-20 |
| 8786098 | Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same | — | 2014-07-22 |