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Sol-gel vaults and methods of making and using thereof |
Leonard H. Rome, Shaily Mahendra, Valerie A. Kickhoefer, Esther Hui-Jen Lan, Bruce S. Dunn |
2025-10-14 |
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Heat sink and communication device |
Yu Zhang, Lei Li, Dong Wang |
2025-06-17 |
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| 12272671 |
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Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou |
2025-04-08 |
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Heat sink and communication device |
Yuping Hong, Xiaowei Hui |
2025-01-21 |
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Multimedia information processing method and apparatus, and storage medium |
Fan Fan, Jiang Li, Ruihua Li, Lelin Wang, Shuo Li +2 more |
2024-09-24 |
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Semiconductor device package and method of manufacturing the same |
Wei-Da Lin, Hung Chen Kuo, Wen Jin Huang |
2024-08-20 |
$8,555,000 |
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Audio coding method and apparatus |
Zhuo Wang, Fan Fan |
2024-08-06 |
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| 12009313 |
Semiconductor package shielding structure |
Chien-Yuan Tseng, Hung Chen Kuo, Ying WEI, Chia-Feng Hsu, Yuan-Long Chiao |
2024-06-11 |
$2,117,000 |
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Optical device package with compatible lid and carrier |
Tsung-Yueh Tsai, Yu-Fang Tsai, Meng-Jung Chuang |
2024-06-11 |
$2,117,000 |
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Meme creation method and apparatus |
Zhuo Wang, Fan Fan, Lelin Wang |
2024-03-26 |
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| 11906638 |
High-accuracy satellite positioning method, positioning terminal, and positioning system |
Hui Li, Yi Zhang, Fuxiang Xiong |
2024-02-20 |
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Semiconductor device package and method of manufacturing the same |
Shang-Ruei Wu, Chien-Yuan Tseng, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li +3 more |
2024-01-30 |
$1,104,000 |
| 11682653 |
Semiconductor device package and method for manufacturing the same |
Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou |
2023-06-20 |
$1,459,000 |
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Package structure and method for manufacturing the same |
Chun Yu KO, Tsu-Hsiu Wu |
2023-04-11 |
$2,406,000 |
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Semiconductor device package and method of manufacturing the same |
Wei-Da Lin, Hung Chen Kuo, Wen Jin Huang |
2023-03-14 |
$2,598,000 |
| 11302682 |
Optical device package |
Tsung-Yueh Tsai, Yu-Fang Tsai, Meng-Jung Chuang |
2022-04-12 |
$1,051,000 |
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Application control method, graphical user interface, and terminal |
Changkuan Chen, Guangyuan Gao |
2022-01-11 |
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Semiconductor device package and method of manufacturing the same |
Shang-Ruei Wu, Chien-Yuan Tseng, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li +3 more |
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$907,000 |
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Semiconductor device package and method for manufacturing the same |
Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou |
2021-03-02 |
$4,651,000 |
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Semiconductor package device |
Jen-Kai Ou, Tsung-Yueh Tsai, Chih-Ming Hung |
2020-01-28 |
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Semiconductor device package and method for manufacturing the same |
Chih-Ming Hung, Tsung-Yueh Tsai, Jen-Kai Ou |
2019-12-31 |
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Fan-out ball grid array package structure and process for manufacturing the same |
Jung-Liang YEH, Tsung-Yueh Tsai, Chih-Ming Hung |
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$2,901,000 |
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Semiconductor device package |
Chi-Tsung Chiu, Cheng-Hsi CHUANG, Hui-Ying Hsieh, Hui Hua LEE |
2018-09-25 |
$1,702,000 |
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Method for manufacturing three-dimensional integrated circuit |
Dongsheng Liu |
2015-08-04 |
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| 8937015 |
Method for forming vias in a substrate |
Chung-Hsi Wu |
2015-01-20 |
$1,580,000 |
