Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8778791 | Semiconductor structure and method for making the same | — | 2014-07-15 |
| 8692362 | Semiconductor structure having conductive vias and method for manufacturing the same | — | 2014-04-08 |
| 8691625 | Method for making a chip package | — | 2014-04-08 |
| 8673774 | Method for forming a via in a substrate | — | 2014-03-18 |
| 8546255 | Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrate | — | 2013-10-01 |
| 8524602 | Method for forming vias in a substrate | — | 2013-09-03 |
| 8486829 | Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via | Chi-Tsung Chiu, Ying-Te Ou | 2013-07-16 |
| 8471156 | Method for forming a via in a substrate and substrate with a via | Kuo-Pin Yang | 2013-06-25 |
| 8466553 | Semiconductor device and semiconductor package having the same | Bing-Hong Cheng | 2013-06-18 |
| 8415807 | Semiconductor structure and method for making the same | — | 2013-04-09 |
| 8390129 | Semiconductor device with a plurality of mark through substrate vias | Chi-Chih Shen, Jen-Chuan Chen, Hui-Shan Chang, Chung-Hsi Wu | 2013-03-05 |
| 8385873 | Equivalent radio frequency notch filter, radio frequency chip, and receiver | Jianjun Zhou, Zhuobiao He, Fan Yang, Yusong Chi, Hongyu Wang +3 more | 2013-02-26 |
| 8350361 | Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via | Chi-Tsung Chiu, Ying-Te Ou | 2013-01-08 |
| 8338235 | Package process of stacked type semiconductor device package structure | — | 2012-12-25 |
| 8310063 | Semiconductor package structure and manufacturing process thereof | — | 2012-11-13 |
| 8252629 | Method for making a stackable package | Kuo-Chung Yee | 2012-08-28 |
| 8072081 | Microelectromechanical system package | — | 2011-12-06 |
| 8039393 | Semiconductor structure, method for manufacturing semiconductor structure and semiconductor package | Chien-Yu Chen | 2011-10-18 |
| 7833815 | Microelectromechanical system package and the method for manufacturing the same | Kuo-Pin Yang | 2010-11-16 |
| 7816265 | Method for forming vias in a substrate | — | 2010-10-19 |
| 7811858 | Package and the method for making the same, and a stacked package | Wei-Chung Wang | 2010-10-12 |
| 7706149 | Micro-electro-mechanical-system package and method for manufacturing the same | Hsueh-An Yang, Wei-Chung Wang, Ming-Chiang Lee, Wei-Pin Huang, Feng Cheng | 2010-04-27 |
| 7696060 | Recyclable stamp device and recyclable stamp process for wafer bond | Jiunn Chen | 2010-04-13 |
| 7625818 | Method for forming vias in a substrate | — | 2009-12-01 |
| 7573124 | Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same | Kuo-Pin Yang, Wei-Min Hsiao, Sheng-Yang Peng | 2009-08-11 |