Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8865520 | Carrier bonding and detaching processes for a semiconductor wafer | Wei-Min Hsiao, Cheng-Hui Hung | 2014-10-21 |
| 8643167 | Semiconductor package with through silicon vias and method for making the same | Chia-Lin Hung, Jen-Chuan Chen, Hui-Shan Chang | 2014-02-04 |
| 8471156 | Method for forming a via in a substrate and substrate with a via | Meng-Jen Wang | 2013-06-25 |
| 8314490 | Chip having a bump and package having the same | — | 2012-11-20 |
| 8188593 | Silicon substrate having through vias and package having the same | Kuo-Hua Chen | 2012-05-29 |
| 7945062 | Microelectromechanical microphone packaging system | Wei-Chung Wang, Sung-Mao Wu, Hsueh-An Yang, Chian-Chi Lin | 2011-05-17 |
| 7833815 | Microelectromechanical system package and the method for manufacturing the same | Meng-Jen Wang | 2010-11-16 |
| 7573124 | Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same | Meng-Jen Wang, Wei-Min Hsiao, Sheng-Yang Peng | 2009-08-11 |
| 7563652 | Method for encapsulating sensor chips | Wei-Min Hsiao | 2009-07-21 |
| 7560744 | Package optical chip with conductive pillars | Wei-Min Hsiao | 2009-07-14 |
| 7435621 | Method of fabricating wafer level package | — | 2008-10-14 |
| 7429499 | Method of fabricating wafer level package | — | 2008-09-30 |
| 7238590 | Package structure of semiconductor and wafer-level formation thereof | Wei-Min Hsiao | 2007-07-03 |
| 7105424 | Method for preparing arylphosphonite antioxidant | Yu-Pen Tsai, Wu-Chung Chiang | 2006-09-12 |
| 6768332 | Semiconductor wafer and testing method for the same | Yueh-Lung Lin, Ho-Ming Tong, Yao-Hsin Feng, Su Tao, Chi Cheng Pan +1 more | 2004-07-27 |
| 6369439 | Strip of semiconductor package | Su Tao, Tai-Chun Huang | 2002-04-09 |
| 6150730 | Chip-scale semiconductor package | Chih-Ming Chung, Jen-Kuang Fang, Su Tao | 2000-11-21 |