Kuo-Pin Yang has been granted 17 US patents while listed as an inventor at Advanced Semiconductor Engineering . The first was granted in 2000 and the most recent in October 2014. Kuo-Pin Yang ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Kuo-Pin Yang in New Taipei, TW.
Patents per Year Patents granted per year, 2000 to 2014 Bar chart with a peak of 3 patents in 2009. peak 3 2000: 1 patents 2000 2002: 1 patents 2004: 1 patents 2004 2006: 1 patents 2007: 1 patents 2007 2008: 2 patents 2009: 3 patents 2009 2010: 1 patents 2011: 1 patents 2011 2012: 2 patents 2013: 1 patents 2013 2014: 2 patents 2014
Issued Patents All Time
Profile Widget
Showing 1–17 of 17 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
8865520 Carrier bonding and detaching processes for a semiconductor wafer Wei-Min Hsiao , Cheng-Hui Hung 2014-10-21
$1,084,000
8643167 Semiconductor package with through silicon vias and method for making the same Chia-Lin Hung , Jen-Chuan Chen , Hui-Shan Chang 2014-02-04
$2,466,000
8471156 Method for forming a via in a substrate and substrate with a via Meng-Jen Wang 2013-06-25
$2,603,000
8314490 Chip having a bump and package having the same — 2012-11-20
$1,593,000
8188593 Silicon substrate having through vias and package having the same Kuo-Hua Chen 2012-05-29
$2,050,000
7945062 Microelectromechanical microphone packaging system Wei-Chung Wang , Sung-Mao Wu , Hsueh-An Yang , Chian-Chi Lin 2011-05-17
$487,000
7833815 Microelectromechanical system package and the method for manufacturing the same Meng-Jen Wang 2010-11-16
$540,000
7573124 Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same Meng-Jen Wang , Wei-Min Hsiao , Sheng-Yang Peng 2009-08-11
$2,075,000
7563652 Method for encapsulating sensor chips Wei-Min Hsiao 2009-07-21
$1,982,000
7560744 Package optical chip with conductive pillars Wei-Min Hsiao 2009-07-14
$940,000
7435621 Method of fabricating wafer level package — 2008-10-14
$298,000
7429499 Method of fabricating wafer level package — 2008-09-30
$242,000
7238590 Package structure of semiconductor and wafer-level formation thereof Wei-Min Hsiao 2007-07-03
$1,052,000
7105424 Method for preparing arylphosphonite antioxidant Yu-Pen Tsai , Wu-Chung Chiang 2006-09-12
$468,000
6768332 Semiconductor wafer and testing method for the same Yueh-Lung Lin , Ho-Ming Tong , Yao-Hsin Feng , Su Tao , Chi Cheng Pan +1 more 2004-07-27
$197,000
6369439 Strip of semiconductor package Su Tao , Tai-Chun Huang 2002-04-09
$3,380,000
6150730 Chip-scale semiconductor package Chih-Ming Chung , Jen-Kuang Fang , Su Tao 2000-11-21