Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266632 | Package process and package structure | Chi-Chih Shen, Tommy Pan | 2025-04-01 |
| 11222866 | Package process and package structure | Chi-Chih Shen, Tommy Pan | 2022-01-11 |
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Hsueh-Te Wang, Wen-Sung Hsu | 2021-04-13 |
| 10573579 | Semiconductor package with improved heat dissipation | Tai-Yu Chen, Wen-Sung Hsu, Sheng-Liang Kuo, Chi-Wen Pan | 2020-02-25 |
| 9698120 | Package process and package structure | Chi-Chih Shen, Tommy Pan | 2017-07-04 |
| 8643167 | Semiconductor package with through silicon vias and method for making the same | Chia-Lin Hung, Hui-Shan Chang, Kuo-Pin Yang | 2014-02-04 |
| 8618645 | Package process and package structure | Chi-Chih Shen, Tommy Pan | 2013-12-31 |
| 8446000 | Package structure and package process | Chi-Chih Shen, Tommy Pan, Hui-Shan Chang, Chia-Lin Hung | 2013-05-21 |
| 8390129 | Semiconductor device with a plurality of mark through substrate vias | Chi-Chih Shen, Hui-Shan Chang, Chung-Hsi Wu, Meng-Jen Wang | 2013-03-05 |
| 8258007 | Package process | Chi-Chih Shen, Hui-Shan Chang, Wen-Hsiung Chang | 2012-09-04 |
| 8158888 | Circuit substrate and method of fabricating the same and chip package structure | Chi-Chih Shen, Wei-Chung Wang | 2012-04-17 |
| 8105877 | Method of fabricating a stacked type chip package structure | Chi-Chih Shen, Hui-Shan Chang | 2012-01-31 |
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Kuang-Hsiung Chen, Chi-Chih Shen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu +5 more | 2011-12-13 |
| 8012797 | Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries | Chi-Chih Shen, Wen-Hsiung Chang, Chi-Chih Chu, Cheng-Yi Weng | 2011-09-06 |
| 7791211 | Flip chip package structure and carrier thereof | Chi-Chih Shen, Hui-Shan Chang, Tommy Pan | 2010-09-07 |