| 12266632 |
Package process and package structure |
Chi-Chih Shen, Tommy Pan |
2025-04-01 |
| 11222866 |
Package process and package structure |
Chi-Chih Shen, Tommy Pan |
2022-01-11 |
| 10978406 |
Semiconductor package including EMI shielding structure and method for forming the same |
Hung-Jen Chang, Hsueh-Te Wang, Wen-Sung Hsu |
2021-04-13 |
| 10573579 |
Semiconductor package with improved heat dissipation |
Tai-Yu Chen, Wen-Sung Hsu, Sheng-Liang Kuo, Chi-Wen Pan |
2020-02-25 |
| 9698120 |
Package process and package structure |
Chi-Chih Shen, Tommy Pan |
2017-07-04 |
| 8643167 |
Semiconductor package with through silicon vias and method for making the same |
Chia-Lin Hung, Hui-Shan Chang, Kuo-Pin Yang |
2014-02-04 |
| 8618645 |
Package process and package structure |
Chi-Chih Shen, Tommy Pan |
2013-12-31 |
| 8446000 |
Package structure and package process |
Chi-Chih Shen, Tommy Pan, Hui-Shan Chang, Chia-Lin Hung |
2013-05-21 |
| 8390129 |
Semiconductor device with a plurality of mark through substrate vias |
Chi-Chih Shen, Hui-Shan Chang, Chung-Hsi Wu, Meng-Jen Wang |
2013-03-05 |
| 8258007 |
Package process |
Chi-Chih Shen, Hui-Shan Chang, Wen-Hsiung Chang |
2012-09-04 |
| 8158888 |
Circuit substrate and method of fabricating the same and chip package structure |
Chi-Chih Shen, Wei-Chung Wang |
2012-04-17 |
| 8105877 |
Method of fabricating a stacked type chip package structure |
Chi-Chih Shen, Hui-Shan Chang |
2012-01-31 |
| 8076765 |
Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors |
Kuang-Hsiung Chen, Chi-Chih Shen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu +5 more |
2011-12-13 |
| 8012797 |
Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries |
Chi-Chih Shen, Wen-Hsiung Chang, Chi-Chih Chu, Cheng-Yi Weng |
2011-09-06 |
| 7791211 |
Flip chip package structure and carrier thereof |
Chi-Chih Shen, Hui-Shan Chang, Tommy Pan |
2010-09-07 |