Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8446546 | Backlight module with bent reflector sheet and display panel device | Ya-Ting Ho, Keng-Ju Liu | 2013-05-21 |
| 8405212 | Semiconductor package | Cheng-Yi Weng | 2013-03-26 |
| 8198131 | Stackable semiconductor device packages | Cheng-Yi Weng, Chien-Yuan Tseng | 2012-06-12 |
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang +5 more | 2011-12-13 |
| 8012797 | Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries | Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Cheng-Yi Weng | 2011-09-06 |
| 7866874 | Backlight module having replaceable light apparatus | Keng-Ju Liu, Wen-Yuan Cheng | 2011-01-11 |
| 7642133 | Method of making a semiconductor package and method of making a semiconductor device | Yen-Yi Wu, Wei-Yueh Sung, Pao-Huei Chang Chien, Cheng-Yin Lee, Gwo-Liang Weng | 2010-01-05 |
| 7473629 | Substrate structure having a solder mask and a process for making the same | Wei-Chang Tai, Meng-Jung Chuang, Cheng-Yin Lee, Yao-Ting Huang, Kuang-Lin Lo | 2009-01-06 |
| 7439619 | Electronic package structure and the packaging process thereof | Gwo-Liang Weng, Shih-Chang Lee | 2008-10-21 |
| 7417329 | System-in-package structure | Meng-Jung Chuang, Cheng-Yin Lee, Wei-Chang Tai | 2008-08-26 |
| 7187070 | Stacked package module | Cheng-Yin Lee, Gwo-Liang Weng, Shih-Chang Lee | 2007-03-06 |
| 7126221 | Semiconductor package | Gwo-Liang Weng, Yung-Li Lu, Shih-Chang Lee | 2006-10-24 |
| 6976781 | Frame and bezel structure for backlight unit | Wen-Yuan Cheng, Hui-Kai Chou | 2005-12-20 |
| 6866397 | Leading wire arrangement of a lighting fixture in a back light module | Wen-Yuan Cheng | 2005-03-15 |