Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7473629 | Substrate structure having a solder mask and a process for making the same | Chi-Chih Chu, Meng-Jung Chuang, Cheng-Yin Lee, Yao-Ting Huang, Kuang-Lin Lo | 2009-01-06 |
| 7417329 | System-in-package structure | Meng-Jung Chuang, Cheng-Yin Lee, Chi-Chih Chu | 2008-08-26 |
| 7195956 | Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units | Gwo-Liang Weng, Shih-Chang Lee | 2007-03-27 |
| 7180181 | Mesh shaped dam mounted on a substrate | Pai-Chou Liu, Sheng Liu | 2007-02-20 |
| 6815833 | Flip chip package | Shih-Chang Lee, Gwo-Liang Weng, Cheng-Yin Lee | 2004-11-09 |