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Multi-row substrate strip and method for manufacturing the same |
Yao-Ting Huang |
2009-03-31 |
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Substrate structure having a solder mask and a process for making the same |
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2009-01-06 |
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Fabrication method for printed circuit board |
Hung-Nan Chen, Jen-Kuang Fang |
2008-06-10 |
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Molding apparatus with a molding flowability sensor for packaging semiconductor device |
Wei Wang, Yun-Lung Chang |
2006-12-05 |
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Packaging mold with electrostatic discharge protection |
Meng-Tsang Lee |
2005-09-13 |
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Packaging substrate with electrostatic discharge protection |
Meng-Tsang Lee |
2004-08-17 |
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Method of manufacturing a semiconductor package with a lead frame having a support structure |
Meng-Tsang Lee |
2003-09-30 |
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Stacked structure of semiconductor package |
Chun-Chi Lee, Kuang-Chwn Chou, Shih-Chih Chen |
2000-12-19 |
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Stacked chip assembly utilizing a lead frame |
Su Tao, Kuang-Chun Chou, Shih-Chih Chen |
2000-09-12 |
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Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance |
Su Tao, Hsin-Hsing Wei |
2000-07-25 |