Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024569 | Semiconductor package device and method of manufacturing the same | Wen-Long LU | 2021-06-01 |
| 10818636 | Substrate panel structure and manufacturing process | Wen-Long LU | 2020-10-27 |
| 10685934 | Semiconductor package device and method of manufacturing the same | Wen-Long LU | 2020-06-16 |
| 10672696 | Semiconductor device package | Wen-Long LU | 2020-06-02 |
| 10636745 | Semiconductor package device and method of manufacturing the same | Wen-Long LU | 2020-04-28 |
| 10566279 | Package device, semiconductor device, and method for manufacturing the package device | Wen-Long LU, Min-Lung Huang, Chan Wen Liu, Ching Kuo Hsu | 2020-02-18 |
| 10269672 | Semiconductor package device and method of manufacturing the same | Wen-Long LU | 2019-04-23 |
| 10224301 | Semiconductor package device and method of manufacturing the same | Wen-Long LU | 2019-03-05 |
| 9748196 | Semiconductor package structure including die and substrate electrically connected through conductive segments | Kuo-Hua Chen | 2017-08-29 |
| 7726544 | Method of packaging flip chip and method of forming pre-solders on substrate thereof | Chung-Hwa Feng | 2010-06-01 |
| 7635610 | Multi-chip stack package and fabricating method thereof | — | 2009-12-22 |
| 7384566 | Fabrication method for printed circuit board | Hung-Nan Chen, Kuang-Lin Lo | 2008-06-10 |
| 7375020 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Yung-I Yeh | 2008-05-20 |
| 7262497 | Bumpless assembly package | — | 2007-08-28 |
| 7064428 | Wafer-level package structure | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2006-06-20 |
| 7041534 | Semiconductor chip package and method for making the same | Shin-Hua Chao, Ho-Ming Tong | 2006-05-09 |
| 6989326 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2006-01-24 |
| 6972583 | Method for testing electrical characteristics of bumps | — | 2005-12-06 |
| 6967153 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-11-22 |
| 6933616 | Multi-chip module packaging device using flip-chip bonding technology | — | 2005-08-23 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-08-09 |
| 6924557 | Semiconductor package | — | 2005-08-02 |
| 6916732 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Yung-I Yeh | 2005-07-12 |
| 6878963 | Device for testing electrical characteristics of chips | — | 2005-04-12 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-04-12 |