Wen-Long LU — 79 Patents at Advanced Semiconductor Engineering

Wen-Long LU has been granted 79 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2017 and the most recent in February 2025. Wen-Long LU ranks #23,150 of 4,157,543 US inventors in our database (top 0.56%). Patent records list Wen-Long LU in Kaohsiung, TW.

Issued Patents All Time

Showing 1–25 of 79 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12224219	Package structure and circuit layer structure including dummy trace and manufacturing method therefor	—	2025-02-11
12142584	Semiconductor device package	—	2024-11-12	$3,194,000
12046523	Semiconductor device packages and methods of manufacturing the same	—	2024-07-23	$4,852,000
11856856	Thermal conduction unit, electronic module and heat dissipating device	—	2023-12-26	$4,189,000
11791227	Electronic device package	Kuoching CHENG, Yuan-Feng Chiang, Ya Fang Chan, Shih-Yu Wang	2023-10-17	$1,071,000
11721652	Semiconductor device package and method of manufacturing the same	—	2023-08-08	$1,262,000
11721645	Semiconductor package device and semiconductor process	—	2023-08-08	$1,262,000
11699682	Semiconductor device package and method of manufacturing the same	—	2023-07-11	$3,735,000
11694984	Package structure including pillars and method for manufacturing the same	—	2023-07-04
11538760	Semiconductor package structure and method for manufacturing the same	—	2022-12-27	$1,115,000
11532542	Wiring structure and method for manufacturing the same	—	2022-12-20	$3,337,000
11495557	Semiconductor device and method of manufacturing the same	Jhao-Cheng CHEN, Huang-Hsien Chang, Shao Hsuan CHUANG, Ching-Ju Chen, Tse-Chuan Chou	2022-11-08	$2,199,000
11430708	Package structure and circuit layer structure including dummy trace and manufacturing method therefor	—	2022-08-30	$854,000
11398408	Semiconductor substrate with trace connected to via at a level within a dielectric layer	—	2022-07-26	$1,044,000
11362052	Semiconductor device package and method of manufacturing the same	Chi-Chang Lee	2022-06-14	$2,344,000
11302644	Semiconductor package structure and method for manufacturing the same	—	2022-04-12	$1,051,000
11302594	Semiconductor package and method of manufacturing the same	—	2022-04-12	$1,051,000
11296002	Semiconductor device package and method for manufacturing the same	—	2022-04-05	$1,088,000
11271312	Semiconductor device package and method for manufacturing the same	—	2022-03-08	$7,937,000
11239174	Semiconductor package structure and method for manufacturing the same	—	2022-02-01	$3,921,000
11222870	Semiconductor device package and method of manufacturing the same	Min-Lung Huang	2022-01-11	$1,882,000
11215762	Optical device package and method for manufacturing the same	Huang-Hsien Chang, Po Ju Wu, Yu-Cheng Chen	2022-01-04	$1,679,000
11217520	Wiring structure, assembly structure and method for manufacturing the same	—	2022-01-04	$1,679,000
11189587	Semiconductor device package with organic reinforcement structure	—	2021-11-30	$1,888,000
11177552	Semiconductor device package and method for manufacturing the same	—	2021-11-16	$3,120,000

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Wen-Long LU — 79 Patents

Issued Patents All Time

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