| 11886015 |
Recessed portion in a substrate and method of forming the same |
Huang-Hsien Chang |
2024-01-30 |
| 11848143 |
Electronic device and method for manufacturing the same |
Yunghsun Chen, Huang-Hsien Chang |
2023-12-19 |
| 11495557 |
Semiconductor device and method of manufacturing the same |
Jhao-Cheng CHEN, Huang-Hsien Chang, Wen-Long LU, Ching-Ju Chen, Tse-Chuan Chou |
2022-11-08 |
| 11410957 |
Semiconductor package structure and method of manufacturing the same |
Huang-Hsien Chang |
2022-08-09 |
| 11411073 |
Semiconductor package device and method for manufacturing the same |
Huang-Hsien Chang, Min-Lung Huang |
2022-08-09 |
| 11398442 |
Bonding structure, package structure, and method for manufacturing package structure |
Wan-Yu Chang |
2022-07-26 |
| 11262506 |
Recessed portion in a substrate and method of forming the same |
Huang-Hsien Chang |
2022-03-01 |
| 11107881 |
Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer |
Huang-Hsien Chang, Min-Lung Huang, Yu-Cheng Chen, Syu-Tang Liu |
2021-08-31 |