| 12249583 |
Package structure, assembly structure and method for manufacturing the same |
Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen |
2025-03-11 |
|
| 12040312 |
Semiconductor package structure and method for manufacturing the same |
Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu |
2024-07-16 |
$2,136,000 |
| 11894340 |
Package structure and method for manufacturing the same |
Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen |
2024-02-06 |
$1,209,000 |
| 11728282 |
Package structure, assembly structure and method for manufacturing the same |
Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen |
2023-08-15 |
$2,451,000 |
| 11508634 |
Semiconductor package structure, electronic device, and method for manufacturing the same |
Syu-Tang Liu |
2022-11-22 |
$2,343,000 |
| 11430750 |
Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer |
Wen-Hung Huang, Yuh-Shan Su |
2022-08-30 |
$854,000 |
| 11428946 |
Method for manufacturing a through substrate via |
Yuan-Feng Chiang, Tsung-Tang Tsai |
2022-08-30 |
$854,000 |
| 11424212 |
Semiconductor package structure and method for manufacturing the same |
Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu |
2022-08-23 |
$3,173,000 |
| 11411073 |
Semiconductor package device and method for manufacturing the same |
Shao Hsuan CHUANG, Huang-Hsien Chang |
2022-08-09 |
$926,000 |
| 11373956 |
Semiconductor device package and method of manufacturing the same |
Hung-Jung Tu, Hsin Hsiang Wang, Chih-Wei Huang, Shiuan-Yu LIN |
2022-06-28 |
$1,974,000 |
| 11355426 |
Wiring structure and method for manufacturing the same |
Wen-Hung Huang |
2022-06-07 |
$7,616,000 |
| 11222870 |
Semiconductor device package and method of manufacturing the same |
Wen-Long LU |
2022-01-11 |
$1,882,000 |
| 11211325 |
Semiconductor device package and method for manufacturing the same |
Wen-Hung Huang, Yan Wen CHUNG |
2021-12-28 |
$1,576,000 |
| 11201110 |
Semiconductor device package with conductive pillars and method for manufacturing the same |
Hung-Jung Tu, Hsin Hsiang Wang |
2021-12-14 |
$2,223,000 |
| 11107881 |
Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer |
Shao Hsuan CHUANG, Huang-Hsien Chang, Yu-Cheng Chen, Syu-Tang Liu |
2021-08-31 |
$2,137,000 |
| 11011491 |
Semiconductor device packages and methods of manufacturing the same |
Shun-Tsat TU, Pei-Jen Lo, Fong Ren Sie, Cheng-En Weng |
2021-05-18 |
$3,233,000 |
| 10939561 |
Wiring structure and method of manufacturing the same |
Wen-Hung Huang |
2021-03-02 |
$4,651,000 |
| 10663746 |
Collimator, optical device and method of manufacturing the same |
Yuan-Feng Chiang, Tsung-Tang Tsai |
2020-05-26 |
$1,407,000 |
| 10566279 |
Package device, semiconductor device, and method for manufacturing the package device |
Wen-Long LU, Jen-Kuang Fang, Chan Wen Liu, Ching Kuo Hsu |
2020-02-18 |
$4,656,000 |
| 10388598 |
Interposer, semiconductor package structure, and semiconductor process |
Wen-Long LU |
2019-08-20 |
$4,771,000 |
| 9960121 |
Semiconductor device having conductive via and manufacturing process for same |
Yung-Jen Chen, Yi Ding |
2018-05-01 |
$1,093,000 |
| 9960102 |
Semiconductor devices and methods of manufacturing the same |
Chung-Hsi Wu |
2018-05-01 |
$1,093,000 |
| 9852971 |
Interposer, semiconductor package structure, and semiconductor process |
Wen-Long LU |
2017-12-26 |
$1,194,000 |
| 9406552 |
Semiconductor device having conductive via and manufacturing process |
Yung-Jen Chen, Yi Ding |
2016-08-02 |
$3,647,000 |
| 8358001 |
Semiconductor device packages, redistribution structures, and manufacturing methods thereof |
Hung-Jen Yang, Chuehan Hsieh |
2013-01-22 |
$988,000 |