Issued Patents All Time
Showing 25 most recent of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249583 | Package structure, assembly structure and method for manufacturing the same | Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen | 2025-03-11 |
| 12040312 | Semiconductor package structure and method for manufacturing the same | Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu | 2024-07-16 |
| 11894340 | Package structure and method for manufacturing the same | Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen | 2024-02-06 |
| 11728282 | Package structure, assembly structure and method for manufacturing the same | Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen | 2023-08-15 |
| 11508634 | Semiconductor package structure, electronic device, and method for manufacturing the same | Syu-Tang Liu | 2022-11-22 |
| 11430750 | Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer | Wen-Hung Huang, Yuh-Shan Su | 2022-08-30 |
| 11428946 | Method for manufacturing a through substrate via | Yuan-Feng Chiang, Tsung-Tang Tsai | 2022-08-30 |
| 11424212 | Semiconductor package structure and method for manufacturing the same | Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu | 2022-08-23 |
| 11411073 | Semiconductor package device and method for manufacturing the same | Shao Hsuan CHUANG, Huang-Hsien Chang | 2022-08-09 |
| 11373956 | Semiconductor device package and method of manufacturing the same | Hung-Jung Tu, Hsin Hsiang Wang, Chih-Wei Huang, Shiuan-Yu LIN | 2022-06-28 |
| 11355426 | Wiring structure and method for manufacturing the same | Wen-Hung Huang | 2022-06-07 |
| 11222870 | Semiconductor device package and method of manufacturing the same | Wen-Long LU | 2022-01-11 |
| 11211325 | Semiconductor device package and method for manufacturing the same | Wen-Hung Huang, Yan Wen CHUNG | 2021-12-28 |
| 11201110 | Semiconductor device package with conductive pillars and method for manufacturing the same | Hung-Jung Tu, Hsin Hsiang Wang | 2021-12-14 |
| 11107881 | Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer | Shao Hsuan CHUANG, Huang-Hsien Chang, Yu-Cheng Chen, Syu-Tang Liu | 2021-08-31 |
| 11011491 | Semiconductor device packages and methods of manufacturing the same | Shun-Tsat TU, Pei-Jen Lo, Fong Ren Sie, Cheng-En Weng | 2021-05-18 |
| 10939561 | Wiring structure and method of manufacturing the same | Wen-Hung Huang | 2021-03-02 |
| 10663746 | Collimator, optical device and method of manufacturing the same | Yuan-Feng Chiang, Tsung-Tang Tsai | 2020-05-26 |
| 10566279 | Package device, semiconductor device, and method for manufacturing the package device | Wen-Long LU, Jen-Kuang Fang, Chan Wen Liu, Ching Kuo Hsu | 2020-02-18 |
| 10388598 | Interposer, semiconductor package structure, and semiconductor process | Wen-Long LU | 2019-08-20 |
| 9960121 | Semiconductor device having conductive via and manufacturing process for same | Yung-Jen Chen, Yi Ding | 2018-05-01 |
| 9960102 | Semiconductor devices and methods of manufacturing the same | Chung-Hsi Wu | 2018-05-01 |
| 9852971 | Interposer, semiconductor package structure, and semiconductor process | Wen-Long LU | 2017-12-26 |
| 9406552 | Semiconductor device having conductive via and manufacturing process | Yung-Jen Chen, Yi Ding | 2016-08-02 |
| 8358001 | Semiconductor device packages, redistribution structures, and manufacturing methods thereof | Hung-Jen Yang, Chuehan Hsieh | 2013-01-22 |