Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12300677 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Chih-Cheng Lee +1 more | 2025-05-13 | |
| 11721678 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Chih-Cheng Lee +1 more | 2023-08-08 | $1,262,000 |
| 11430750 | Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer | Wen-Hung Huang, Min-Lung Huang | 2022-08-30 | $854,000 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Chih-Cheng Lee +1 more | 2021-05-25 | $3,251,000 |