Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300677 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Chih-Cheng Lee +1 more | 2025-05-13 |
| 11721678 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Chih-Cheng Lee +1 more | 2023-08-08 |
| 11430750 | Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer | Wen-Hung Huang, Min-Lung Huang | 2022-08-30 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Chih-Cheng Lee +1 more | 2021-05-25 |