Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315828 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2025-05-27 |
| 12300677 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2025-05-13 |
| 12040287 | Semiconductor device package and method for manufacturing the same | Chih-Cheng Lee | 2024-07-16 |
| 11997798 | Package substrate and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2024-05-28 |
| 11830834 | Semiconductor device, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2023-11-28 |
| 11721678 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2023-08-08 |
| 11715694 | Embedded component package structure having a magnetically permeable layer | Chih-Cheng Lee | 2023-08-01 |
| 11469186 | Semiconductor device package and method for manufacturing the same | Chih-Cheng Lee | 2022-10-11 |
| 11432406 | Package substrate | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2022-08-30 |
| 11335650 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2022-05-17 |
| 11239184 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2022-02-01 |
| 11062996 | Embedded component package structure and manufacturing method thereof | Chih-Cheng Lee | 2021-07-13 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2021-05-25 |
| 10276507 | Embedded component package structure and method of manufacturing the same | Chih-Cheng Lee | 2019-04-30 |
| 9997442 | Semiconductor device and method of manufacturing the same | Chai-Chi Lin, Chih-Cheng Lee, Chih-Yung Yang | 2018-06-12 |
| 9887167 | Embedded component package structure and method of manufacturing the same | Chih-Cheng Lee, Li-Chuan Tsai | 2018-02-06 |
| 9721899 | Embedded component package structure and method of manufacturing the same | Chih-Cheng Lee | 2017-08-01 |