Issued Patents All Time
Showing 25 most recent of 145 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431872 | Semiconductor circuit and method for operating the same | Chin-Hua Wen | 2025-09-30 |
| 12418997 | Display device | Jingchang SU, Xin Bi, Jianjun Wu, Xianfeng Yang, Jiahua Wang +3 more | 2025-09-16 |
| 12406951 | Redistribution layer having a sideview zig-zag profile | Kuan-Hsiang Mao, Yufu Liu, Tsung Nan Lo | 2025-09-02 |
| 12339970 | Secure boot device, method and electronic system using the same | — | 2025-06-24 |
| 12324216 | Metal gates for multi-gate devices and fabrication methods thereof | Jo-Chun Hung, Chih-Wei Lee, Kuo-Feng Yu | 2025-06-03 |
| 12315797 | Semiconductor substrate structure and method of manufacturing the same | — | 2025-05-27 |
| 12317574 | Device providing multiple threshold voltages and methods of making the same | Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Mei-Yun Wang | 2025-05-27 |
| 12315820 | Wiring structure including low- and high-density conductive structures | — | 2025-05-27 |
| 12302627 | Semiconductor device with non-conformal gate dielectric layers | Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Kuei-Lun Lin | 2025-05-13 |
| 12300677 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Yuh-Shan Su, Chih-Cheng Lee +1 more | 2025-05-13 |
| 12288770 | Semiconductor packages with embedded wiring on re-distributed bumps | Kuan-Hsiang Mao, Norazham Mohd Sukemi, Chin Teck Siong, Tsung Nan Lo | 2025-04-29 |
| 12266575 | Multiple gate field-effect transistors having various gate oxide thicknesses and methods of forming the same | Chih-Wei Lee, Kuo-Feng Yu, Jian-Hao Chen, Hsueh-Ju Chen, Zoe Chen | 2025-04-01 |
| 12249585 | Semiconductor device package | — | 2025-03-11 |
| 12198998 | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process | Kuan-Hsiang Mao, Che Ming Fang, Yufu Liu | 2025-01-14 |
| 12100737 | Nanowire stack GAA device with selectable numbers of channel strips | Ya-Jui Tsou, Zong-You Luo, Jhih-Yang Yan, Chee-Wee Liu | 2024-09-24 |
| 12080601 | Packaged semiconductor devices and methods therefor | Kuan-Hsiang Mao, Yufu Liu | 2024-09-03 |
| 12034572 | Decision feedback equalization embedded in slicer | Shu-Chun Yang | 2024-07-09 |
| 12021044 | Semiconductor device package and method of manufacturing the same | — | 2024-06-25 |
| 12009400 | Device providing multiple threshold voltages and methods of making the same | Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Mei-Yun Wang | 2024-06-11 |
| 11961799 | Semiconductor substrate structure and method of manufacturing the same | — | 2024-04-16 |
| 11935753 | Backside and sidewall metallization of semiconductor devices | Kuan-Hsiang Mao, Che Ming Fang, Yufu Liu | 2024-03-19 |
| 11923274 | Semiconductor device package including promoters and method of manufacturing the same | — | 2024-03-05 |
| 11908815 | Semiconductor device package | — | 2024-02-20 |
| 11908745 | Semiconductor device with non-conformal gate dieletric layers | Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Kuei-Lun Lin | 2024-02-20 |
| 11894293 | Circuit structure and electronic structure | — | 2024-02-06 |