| 12431872 |
Semiconductor circuit and method for operating the same |
Chin-Hua Wen |
2025-09-30 |
|
| 12418997 |
Display device |
Jingchang SU, Xin Bi, Jianjun Wu, Xianfeng Yang, Jiahua Wang +3 more |
2025-09-16 |
|
| 12406951 |
Redistribution layer having a sideview zig-zag profile |
Kuan-Hsiang Mao, Yufu Liu, Tsung Nan Lo |
2025-09-02 |
|
| 12339970 |
Secure boot device, method and electronic system using the same |
— |
2025-06-24 |
|
| 12324216 |
Metal gates for multi-gate devices and fabrication methods thereof |
Jo-Chun Hung, Chih-Wei Lee, Kuo-Feng Yu |
2025-06-03 |
|
| 12315797 |
Semiconductor substrate structure and method of manufacturing the same |
— |
2025-05-27 |
|
| 12317574 |
Device providing multiple threshold voltages and methods of making the same |
Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Mei-Yun Wang |
2025-05-27 |
|
| 12315820 |
Wiring structure including low- and high-density conductive structures |
— |
2025-05-27 |
|
| 12300677 |
Semiconductor device package including stress buffering layer |
Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Yuh-Shan Su, Chih-Cheng Lee +1 more |
2025-05-13 |
|
| 12302627 |
Semiconductor device with non-conformal gate dielectric layers |
Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Kuei-Lun Lin |
2025-05-13 |
|
| 12288770 |
Semiconductor packages with embedded wiring on re-distributed bumps |
Kuan-Hsiang Mao, Norazham Mohd Sukemi, Chin Teck Siong, Tsung Nan Lo |
2025-04-29 |
|
| 12266575 |
Multiple gate field-effect transistors having various gate oxide thicknesses and methods of forming the same |
Chih-Wei Lee, Kuo-Feng Yu, Jian-Hao Chen, Hsueh-Ju Chen, Zoe Chen |
2025-04-01 |
|
| 12249585 |
Semiconductor device package |
— |
2025-03-11 |
|
| 12198998 |
Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process |
Kuan-Hsiang Mao, Che Ming Fang, Yufu Liu |
2025-01-14 |
|
| 12100737 |
Nanowire stack GAA device with selectable numbers of channel strips |
Ya-Jui Tsou, Zong-You Luo, Jhih-Yang Yan, Chee-Wee Liu |
2024-09-24 |
$29,611,000 |
| 12080601 |
Packaged semiconductor devices and methods therefor |
Kuan-Hsiang Mao, Yufu Liu |
2024-09-03 |
$48,113,000 |
| 12034572 |
Decision feedback equalization embedded in slicer |
Shu-Chun Yang |
2024-07-09 |
$15,647,000 |
| 12021044 |
Semiconductor device package and method of manufacturing the same |
— |
2024-06-25 |
$10,697,000 |
| 12009400 |
Device providing multiple threshold voltages and methods of making the same |
Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Mei-Yun Wang |
2024-06-11 |
$12,601,000 |
| 11961799 |
Semiconductor substrate structure and method of manufacturing the same |
— |
2024-04-16 |
$3,144,000 |
| 11935753 |
Backside and sidewall metallization of semiconductor devices |
Kuan-Hsiang Mao, Che Ming Fang, Yufu Liu |
2024-03-19 |
$130,000,000 |
| 11923274 |
Semiconductor device package including promoters and method of manufacturing the same |
— |
2024-03-05 |
$3,077,000 |
| 11908815 |
Semiconductor device package |
— |
2024-02-20 |
$2,961,000 |
| 11908745 |
Semiconductor device with non-conformal gate dieletric layers |
Yung-Hsiang Chan, Shan-Mei Liao, Jian-Hao Chen, Kuo-Feng Yu, Kuei-Lun Lin |
2024-02-20 |
$8,912,000 |
| 11894293 |
Circuit structure and electronic structure |
— |
2024-02-06 |
$1,209,000 |
