Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406951 | Redistribution layer having a sideview zig-zag profile | Kuan-Hsiang Mao, Yufu Liu, Wen-Hung Huang | 2025-09-02 |
| 12288770 | Semiconductor packages with embedded wiring on re-distributed bumps | Kuan-Hsiang Mao, Norazham Mohd Sukemi, Chin Teck Siong, Wen-Hung Huang | 2025-04-29 |
| 11728308 | Semiconductor device under bump structure and method therefor | Sharon Huey Lin Tay, Antonio Aguinaldo Marquez Macatangay | 2023-08-15 |
| 10390440 | Solderless inter-component joints | CHUNG-HSIUNG HO | 2019-08-20 |