Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288770 | Semiconductor packages with embedded wiring on re-distributed bumps | Kuan-Hsiang Mao, Chin Teck Siong, Tsung Nan Lo, Wen-Hung Huang | 2025-04-29 |
| 10787361 | Sensor device with flip-chip die and interposer | Stanley Job Doraisamy, Meng Kong Lye | 2020-09-29 |