Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10787361 | Sensor device with flip-chip die and interposer | Meng Kong Lye, Norazham Mohd Sukemi | 2020-09-29 |
| 9293395 | Lead frame with mold lock structure | Wai Keong Wong, Soo Choong Chee | 2016-03-22 |
| 9171786 | Integrated circuit with recess for die attachment | Soon Kang Chan, Soo Choong Chee, Dominic Koey | 2015-10-27 |
| 9136399 | Semiconductor package with gel filled cavity | Soon Kang Chan, Soo Choong Chee | 2015-09-15 |
| 8642394 | Method of manufacturing electronic device on leadframe | Abdul Rahman Mohamed, Tien Lai Tan, Ralf Otremba | 2014-02-04 |
| 8377753 | Method of fabricating a semiconductor device having a resin with warpage compensated structures | Chai Wei Heng, Wae Chet Yong, Khai Huat Jeffrey Low, Gerhard Deml | 2013-02-19 |
| 8110906 | Semiconductor device including isolation layer | Joachim Mahler, Wae Chet Yong, Gerhard Deml, Rupert Fischer, Reimund Engl | 2012-02-07 |
| 8067841 | Semiconductor devices having a resin with warpage compensated surfaces | Chai Wei Heng, Wae Chet Yong, Khai Huat Jeffrey Low, Gerhard Deml | 2011-11-29 |
| 7791182 | Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing | Wae Chet Yong, Mohd Fauzi HJ Mahat, Tien Lai Tan | 2010-09-07 |
| 7723165 | Method of forming component package | Soon Hock Tong, Wae Chet Yong | 2010-05-25 |