Issued Patents All Time
Showing 1–25 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412815 | Semiconductor package and method of manufacturing a semiconductor package | Thomas Beer, Daniel Hoelzl, Klaus Schiess | 2025-09-09 |
| 12347754 | Package with load terminals on which coupled power component and logic component are mounted | — | 2025-07-01 |
| 12264867 | Cryostat socket for holding an ion trap device mounted on a substrate in a cryostat | Günther Lohmann, Josef Höglauer, Clemens Rössler, Silke Katharina Auchter | 2025-04-01 |
| 12261146 | Semiconductor package | Edward Fuergut, Irmgard Escher-Poeppel, Martin Gruber | 2025-03-25 |
| 12205870 | Semiconductor package and method for fabricating a semiconductor package | Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone | 2025-01-21 |
| 12136623 | Multi-device semiconductor chip with electrical access to devices at either side | Edward Fuergut, Peter Friedrichs, Hans-Joachim Schulze | 2024-11-05 |
| 12068226 | Semiconductor assembly with multi-device cooling | — | 2024-08-20 |
| 12068213 | Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof | Thai Kee Gan, Sanjay Kumar Murugan | 2024-08-20 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee +1 more | 2024-05-14 |
| 11978693 | Semiconductor device package comprising side walls connected with contact pads of a semiconductor die | Petteri Palm, Ulrich Froehler, Andreas Riegler | 2024-05-07 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Jo Ean Joanna Chye, Edward Fuergut | 2024-03-12 |
| 11923276 | Semiconductor device including a bidirectional switch | Klaus Schiess, Michael Treu | 2024-03-05 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2024-02-27 |
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Fabian Schnoy | 2023-10-03 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Edward Fuergut, Irmgard Escher-Poeppel, Martin Gruber | 2023-08-01 |
| 11688670 | Semiconductor package and method for fabricating a semiconductor package | Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone | 2023-06-27 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Teck Sim Lee, Klaus Schiess, Xaver Schloegel, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |
| 11605577 | Semiconductor device including a bidirectional switch | Klaus Schiess, Michael Treu | 2023-03-14 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2023-03-07 |
| 11450642 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2022-09-20 |
| 11424217 | Soldering a conductor to an aluminum layer | Alexander Heinrich, Stefan Schwab | 2022-08-23 |
| 11355424 | Multi-chip package | Teck Sim Lee, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2022-06-07 |
| 11329000 | Package for a multi-chip power semiconductor device | — | 2022-05-10 |