Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2024-05-28 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Ralf Otremba, Teck Sim Lee, Klaus Schiess, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |
| 11539291 | Method of manufacturing a power semiconductor system | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2022-12-27 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2021-01-26 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber +2 more | 2021-01-05 |
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2020-11-10 |
| 10700037 | Reinforcement for electrical connectors | Eung San Cho, Thorsten Meyer, Thomas Behrens, Josef Hoeglauer | 2020-06-30 |
| 10699978 | SMD package with top side cooling | Ralf Otremba, Amirul Afiq Hud, Teck Sim Lee, Bernd Schmoelzer | 2020-06-30 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Markus Dinkel, Josef Hoeglauer, Klaus Schiess | 2020-06-30 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2020-03-24 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2020-02-18 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess +3 more | 2019-02-12 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Teck Sim Lee, Ralf Otremba, Klaus Schiess, Juergen Schredl | 2018-06-05 |
| 9978671 | Power semiconductor device | Ralf Otremba, Fabio Brucchi, Teck Sim Lee, Franz Stueckler | 2018-05-22 |
| 9824958 | Chip carrier structure, chip package and method of manufacturing the same | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Klaus Schiess | 2017-11-21 |
| 9786584 | Lateral element isolation device | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Klaus Schiess | 2017-10-10 |
| 9627292 | Semiconductor housing with rear-side structuring | Ralf Otremba, Josef Hoeglauer, Juergen Schredl | 2017-04-18 |
| 9515060 | Multi-chip semiconductor power device | Ralf Otremba, Josef Hoeglauer, Chooi Mei Chong | 2016-12-06 |
| 9449902 | Semiconductor packages having multiple lead frames and methods of formation thereof | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Klaus Schiess | 2016-09-20 |
| 9412626 | Method for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Klaus Schiess, Bernd Roemer +1 more | 2016-08-09 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Wolfram Hable, Manfred Mengel +2 more | 2016-07-19 |
| 9379046 | Module comprising a semiconductor chip | Ralf Otremba, Khai Huat Jeffrey Low, Chee Soon Law | 2016-06-28 |
| 9362240 | Electronic device | Khalil Hosseini, Joachim Mahler, Ralf Otremba, Josef Hoeglauer, Juergen Schredl +1 more | 2016-06-07 |
| 9263440 | Power transistor arrangement and package having the same | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Klaus Schiess | 2016-02-16 |
| 9230880 | Electronic device and method for fabricating an electronic device | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Teck Sim Lee, Klaus Schiess | 2016-01-05 |