Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641779 | Thermoelectric devices and methods for forming thermoelectric devices | Christian Kasztelan, Alexander Breymesser, Andreas Niederhofer | 2023-05-02 |
| 11049790 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Edward Fuergut | 2021-06-29 |
| 10930614 | Chip arrangements | Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger, Lim Fong +2 more | 2021-02-23 |
| 10546767 | Wafer box, wafer stacking aid, wafer carrier, wafer transport system, method for loading a wafer box with wafers and method for removing wafers from a wafer box | Nina Wenger, Andreas Niederhofer, Holger Tamme | 2020-01-28 |
| 10535542 | Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer | Andreas Niederhofer, Holger Tamme, Nina Wenger | 2020-01-14 |
| 9984897 | Method for manufacturing a chip arrangement including a ceramic layer | Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz | 2018-05-29 |
| 9790086 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler | 2017-10-17 |
| 9735126 | Solder alloys and arrangements | Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger, Lim Fong +2 more | 2017-08-15 |
| 9567211 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler | 2017-02-14 |
| 9559078 | Electronic component | Joachim Mahler, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz | 2017-01-31 |
| 9437513 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Edward Fuergut | 2016-09-06 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Wolfram Hable +2 more | 2016-07-19 |
| 9385111 | Electronic component with electronic chip between redistribution structure and mounting structure | Edward Fürgut, Ralf Otremba, Jürgen Högerl | 2016-07-05 |
| 9318473 | Semiconductor device including a polymer disposed on a carrier | Joachim Mahler, Khalil Hosseini, Edward Fuergut | 2016-04-19 |
| 9313897 | Method for electrophoretically depositing a film on an electronic assembly | Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz | 2016-04-12 |
| 9313898 | Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions | Joachim Mahler | 2016-04-12 |
| 9245868 | Method for manufacturing a chip package | Holger Torwesten | 2016-01-26 |
| 9093416 | Chip-package and a method for forming a chip-package | Thomas Wowra, Joachim Mahler, Khalil Hosseini | 2015-07-28 |
| 9059083 | Semiconductor device | Henrik Ewe, Joachim Mahler, Reimund Engl, Josef Hoeglauer, Jochen Dangelmaier | 2015-06-16 |
| 9048338 | Device including two power semiconductor chips and manufacturing thereof | Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz | 2015-06-02 |
| 9021887 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler | 2015-05-05 |
| 8952545 | Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof | Ralf Otremba, Henrik Ewe, Klaus Schiess | 2015-02-10 |
| 8945990 | Chip package and method of forming the same | Holger Torwesten, Stefan Schmid, Soon Lock Goh, Swee Kah Lee | 2015-02-03 |
| 8947886 | Electronic component | Joachim Mahler, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz | 2015-02-03 |
| 8912450 | Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module | Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz | 2014-12-16 |