Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Joachim Mahler +3 more | 2021-08-03 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum +1 more | 2019-10-01 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Joachim Mahler +3 more | 2019-08-27 |
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler +2 more | 2017-12-26 |
| 9806043 | Method of manufacturing molded semiconductor packages having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum +1 more | 2017-10-31 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Swee Kah Lee, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Poh Cheng Lim +2 more | 2017-01-10 |
| 9287238 | Leadless semiconductor package with optical inspection feature | Swee Kah Lee | 2016-03-15 |
| 8945990 | Chip package and method of forming the same | Holger Torwesten, Manfred Mengel, Stefan Schmid, Swee Kah Lee | 2015-02-03 |
| 8304295 | Method of manufacturing an electronic device with a package locking system | Swee Kah Lee, Chin Wei Tan | 2012-11-06 |
| 7955901 | Method for producing a power semiconductor module comprising surface-mountable flat external contacts | Henrik Ewe, Stefan Landau, Klaus Schiess, Robert Bergmann, Alvin Wee Beng Tatt +3 more | 2011-06-07 |
| 7838332 | Method of manufacturing a semiconductor package with a bump using a carrier | Chau Fatt Chiang | 2010-11-23 |