Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Chan Lam Cha, Ying Dieh Cheong, Cher Hau Danny Koh, Wern Ken Daryl Wee +7 more | 2025-05-13 |
| 12218038 | Leadframe, semiconductor package and method | Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Swee Kah Lee, Khay Chwan Saw | 2025-02-04 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee, Swee Kah Lee +2 more | 2024-12-24 |
| 12021000 | Semiconductor package and method for fabricating a semiconductor package | Khay Chwan Saw, Norliza Morban | 2024-06-25 |
| 11791169 | Dual step laser processing of an encapsulant of a semiconductor chip package | Pei Luan Pok, Roslie Saini bin Bakar, Chee Hong Lee, Swee Kah Lee, Yu Shien Leong +2 more | 2023-10-17 |
| 11587800 | Semiconductor package with lead tip inspection feature | Khay Chwan Saw, Chee Voon Tan | 2023-02-21 |
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Stefan Macheiner, Wae Chet Yong | 2023-01-31 |
| 11302613 | Double-sided cooled molded semiconductor package | Swee Kah Lee, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2022-04-12 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |
| 11174152 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2021-11-16 |
| 11133281 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Stefan Macheiner, Wae Chet Yong | 2021-09-28 |
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2021-08-03 |
| 10886199 | Molded semiconductor package with double-sided cooling | Swee Kah Lee, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2021-01-05 |
| 10796981 | Chip to lead interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw | 2020-10-06 |
| 10777536 | Semiconductor package with air cavity | April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin, Hock Heng Chong +8 more | 2020-09-15 |
| 10639833 | Molding system with movable mold tool | Khar Foong Chung | 2020-05-05 |
| 10631100 | Micro-electrical mechanical system sensor package and method of manufacture thereof | Kok Yau Chua | 2020-04-21 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Christian Geissler, Bernd Goller, Thomas Kilger +5 more | 2020-02-04 |
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2019-12-10 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Khar Foong Chung, Chee Hong Fang, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2019-08-27 |
| 10396018 | Multi-phase half bridge driver package and methods of manufacture | Chan Lam Cha, Wei Han Koo, Andreas Kucher, Theng Chao Long | 2019-08-27 |
| 10304780 | Device having substrate with conductive pillars | Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko | 2019-05-28 |
| 10163812 | Device having substrate with conductive pillars | Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko | 2018-12-25 |
| 10099411 | Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips | Choon Huey Wang, Swee Kah Lee, Chee Hong Fang | 2018-10-16 |