Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368111 | Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods | Walter Hartner, Christian Geissler, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Martin Richard Niessner +1 more | 2025-07-22 |
| 11823970 | Radar package with optical lens for radar waves | Bernhard Rieder | 2023-11-21 |
| 11416730 | Radio-frequency device with radio-frequency signal carrying element and associated production method | Bernhard Rieder | 2022-08-16 |
| 11195787 | Semiconductor device including an antenna | Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier +4 more | 2021-12-07 |
| 10930541 | Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package | Francesca Arcioni, Maciej Wojnowski | 2021-02-23 |
| 10626012 | Semiconductor device including a cavity lid | Franz-Xaver Muehlbauer, Dominic Maier | 2020-04-21 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more | 2020-02-04 |
| 10224317 | Integrated system and method of making the integrated system | — | 2019-03-05 |
| 9981843 | Chip package and a method of producing the same | Dominic Maier, Alfons Dehe, Markus Menath, Franz-Xaver Muehlbauer, Daniel Porwol +1 more | 2018-05-29 |
| 9806056 | Method of packaging integrated circuits | Ulrich Wachter, Dominic Maier | 2017-10-31 |
| 9725303 | Semiconductor device including a MEMS die and a conductive layer | Dominic Maier, Franz-Xaver Muehlbauer | 2017-08-08 |
| 9718678 | Package arrangement, a package, and a method of manufacturing a package arrangement | Ulrich Wachter | 2017-08-01 |
| 9704843 | Integrated system and method of making the integrated system | — | 2017-07-11 |
| 9487392 | Method of packaging integrated circuits and a molded package | Ulrich Wachter, Dominic Maier | 2016-11-08 |
| 9275878 | Metal redistribution layer for molded substrates | Ulrich Wachter, Dominic Maier | 2016-03-01 |
| 9147585 | Method for fabricating a plurality of semiconductor devices | Ulrich Wachter, Dominic Maier, Gottfried Beer | 2015-09-29 |
| 9136213 | Integrated system and method of making the integrated system | — | 2015-09-15 |
| 9099454 | Molded semiconductor package with backside die metallization | Ulrich Wachter, Veronika Huber, Ralf Otremba, Bernd Stadler, Dominic Maier +3 more | 2015-08-04 |
| 9041505 | System and method for a coreless transformer | Gottfried Beer, Urs Elrod, Christiane Brunner | 2015-05-26 |
| 8890284 | Semiconductor device | Ulrich Wachter, Dominic Maier, Gottfried Beer | 2014-11-18 |
| 8828807 | Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound | Ulrich Wachter, Dominic Maier | 2014-09-09 |
| 8552828 | System and method for a coreless transformer | Gottfried Beer, Urs Elrod, Christiane Brunner | 2013-10-08 |
| 7847387 | Electrical device and method | Horst Theuss | 2010-12-07 |
| 7354797 | Method for producing a plurality of electronic devices | Stefan Paulus | 2008-04-08 |
| 7067915 | Electronic device with external contact elements and method for producing a plurality of the devices | Stefan Paulus | 2006-06-27 |