JL

Johannes Lodermeyer

Infineon Technologies Ag: 11 patents #789 of 7,486Top 15%
IA Infineon Technologies Austria Ag: 1 patents #668 of 1,126Top 60%
Overall (All Time): #399,024 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12368111 Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods Walter Hartner, Christian Geissler, Thomas Kilger, Franz-Xaver Muehlbauer, Martin Richard Niessner +1 more 2025-07-22
11387533 Semiconductor package with plastic waveguide Maciej Wojnowski, Dirk Hammerschmidt, Walter Hartner, Chiara Mariotti, Thorsten Meyer 2022-07-12
10923364 Methods for producing packaged semiconductor devices Kristina Mayer, Michael Ledutke 2021-02-16
10734352 Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement Irmgard Escher-Poeppel, Khalil Hosseini, Joachim Mahler, Thorsten Meyer, Georg Meyer-Berg +6 more 2020-08-04
10571682 Tilted chip assembly for optical devices Ludwig Heitzer, Derek Debie, Klaus Elian, Cyrus Ghahremani, Oskar Neuhoff +1 more 2020-02-25
10549985 Semiconductor package with a through port for sensor applications Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more 2020-02-04
9437516 Chip-embedded packages with backside die connection Ralf Otremba, Josef Höglauer, Manfred Schindler, Thorsten Scharf 2016-09-06
9331060 Device including two power semiconductor chips and manufacturing thereof Ralf Otremba, Josef Hoeglauer, Joachim Mahler 2016-05-03
8975711 Device including two power semiconductor chips and manufacturing thereof Ralf Otremba, Josef Hoeglauer, Joachim Mahler 2015-03-10
8603864 Method of fabricating a semiconductor device Edmund Riedl, Ivan Nikitin, Robert Bergmann, Karsten Guth 2013-12-10
7989930 Semiconductor package Edmund Riedl, Joachim Mahler, Mathias Vaupel, Steffen Jordan 2011-08-02
7909978 Method of making an integrated circuit including electrodeposition of metallic chromium Edmund Riedl, Werner Robl 2011-03-22