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Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods |
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2025-07-22 |
| 11387533 |
Semiconductor package with plastic waveguide |
Maciej Wojnowski, Dirk Hammerschmidt, Walter Hartner, Chiara Mariotti, Thorsten Meyer |
2022-07-12 |
| 10923364 |
Methods for producing packaged semiconductor devices |
Kristina Mayer, Michael Ledutke |
2021-02-16 |
| 10734352 |
Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement |
Irmgard Escher-Poeppel, Khalil Hosseini, Joachim Mahler, Thorsten Meyer, Georg Meyer-Berg +6 more |
2020-08-04 |
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Tilted chip assembly for optical devices |
Ludwig Heitzer, Derek Debie, Klaus Elian, Cyrus Ghahremani, Oskar Neuhoff +1 more |
2020-02-25 |
| 10549985 |
Semiconductor package with a through port for sensor applications |
Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more |
2020-02-04 |
| 9437516 |
Chip-embedded packages with backside die connection |
Ralf Otremba, Josef Höglauer, Manfred Schindler, Thorsten Scharf |
2016-09-06 |
| 9331060 |
Device including two power semiconductor chips and manufacturing thereof |
Ralf Otremba, Josef Hoeglauer, Joachim Mahler |
2016-05-03 |
| 8975711 |
Device including two power semiconductor chips and manufacturing thereof |
Ralf Otremba, Josef Hoeglauer, Joachim Mahler |
2015-03-10 |
| 8603864 |
Method of fabricating a semiconductor device |
Edmund Riedl, Ivan Nikitin, Robert Bergmann, Karsten Guth |
2013-12-10 |
| 7989930 |
Semiconductor package |
Edmund Riedl, Joachim Mahler, Mathias Vaupel, Steffen Jordan |
2011-08-02 |
| 7909978 |
Method of making an integrated circuit including electrodeposition of metallic chromium |
Edmund Riedl, Werner Robl |
2011-03-22 |