Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11655143 | Semiconductor component and method for producing same | Bernhard Knott, Horst Theuss | 2023-05-23 |
| 11287344 | Pressure sensor module having a sensor chip and passive devices within a housing | Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss +1 more | 2022-03-29 |
| 10947109 | Semiconductor component and method for producing same | Bernhard Knott, Horst Theuss | 2021-03-16 |
| 10781095 | Molded lead frame sensor package | Jochen Dangelmaier, Manfred Schindler, Horst Theuss | 2020-09-22 |
| 10677675 | Pressure sensor module having a sensor chip and passive devices within a housing | Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss +1 more | 2020-06-09 |
| 10519030 | Transducer package with integrated sealing | Klaus Elian, Franz Gabler, Thomas Mueller, Horst Theuss | 2019-12-31 |
| 10107867 | Sensor arrangement, battery cell and energy system | Klaus Elian, Jochen Dangelmaier, Franz Michael Darrer, Thomas Mueller, Manfred Fries +6 more | 2018-10-23 |
| 10060819 | Pressure sensor module having a sensor chip and passive devices within a housing | Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss +1 more | 2018-08-28 |
| 9984927 | Method and apparatus for separating semiconductor devices from a wafer | Kurt Gehrig, Kian Pin Queck | 2018-05-29 |
| 9748611 | Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery | Klaus Elian, Jochen Dangelmaier, Manfred Fries, Juergen Hoegerl, Georg Meyer-Berg +3 more | 2017-08-29 |
| 9448130 | Sensor arrangement | Horst Theuss, Thomas Lehmann | 2016-09-20 |
| 9366593 | Pressure sensor package with integrated sealing | Horst Theuss, Helmut Wietschorke | 2016-06-14 |
| 9312226 | Semiconductor device having an identification mark | Stefan Martens, Berthold Schuderer, Raimund Peichl | 2016-04-12 |
| 9196535 | Method and apparatus for separating semiconductor devices from a wafer | Kurt Gehrig, Kian Pin Queck | 2015-11-24 |
| 9147639 | Semiconductor dies having opposing sides with different reflectivity | Günther Ruhl | 2015-09-29 |
| 9099547 | Testing process for semiconductor devices | Stefan Martens | 2015-08-04 |
| 9013014 | Chip package and a method of manufacturing the same | Bernhard Winkler, Horst Theuss | 2015-04-21 |
| 8937380 | Die edge protection for pressure sensor packages | Uwe Schindler | 2015-01-20 |
| 8883565 | Separation of semiconductor devices from a wafer carrier | Sebastian Bernrieder, Adolf Koller, Stefan Martens | 2014-11-11 |
| 8786085 | Semiconductor structure and method for making same | Hans-Joachim Barth, Rainer Steiner, Werner Robl, Jens Pohl, Joern Plagmann +1 more | 2014-07-22 |
| 8759207 | Semiconductor structure and method for making same | Hans-Joachim Barth, Rainer Steiner, Werner Robl, Jens Pohl, Joem Plagmann +1 more | 2014-06-24 |
| 8592999 | Semiconductor chip and method for fabricating the same | — | 2013-11-26 |
| 8334202 | Device fabricated using an electroplating process | Jens Pohl, Hans-Joachim Barth, Gottfried Beer, Rainer Steiner, Werner Robl | 2012-12-18 |
| 8330274 | Semiconductor structure and method for making same | Hans-Joachim Barth, Gottfried Beer, Joern Plagmann, Jens Pohl, Werner Robl +1 more | 2012-12-11 |
| 8148257 | Semiconductor structure and method for making same | Hans-Joachim Barth, Gottfried Beer, Joern Plagmann, Jens Pohl, Werner Robl +1 more | 2012-04-03 |