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Current sensor device |
Udo Ausserlechner, Volker Strutz, Jochen Dangelmaier |
2017-05-23 |
| 9041226 |
Chip arrangement and a method of manufacturing a chip arrangement |
Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg, Joachim Mahler |
2015-05-26 |
| 8786085 |
Semiconductor structure and method for making same |
Hans-Joachim Barth, Mathias Vaupel, Werner Robl, Jens Pohl, Joern Plagmann +1 more |
2014-07-22 |
| 8759207 |
Semiconductor structure and method for making same |
Hans-Joachim Barth, Mathias Vaupel, Werner Robl, Jens Pohl, Joem Plagmann +1 more |
2014-06-24 |
| 8659135 |
Semiconductor device stack and method for its production |
Michael Bauer, Ulrich Bachmaier, Robert-Christian Hagen, Jens Pohl, Hermann Vllsmeler +2 more |
2014-02-25 |
| 8334202 |
Device fabricated using an electroplating process |
Jens Pohl, Hans-Joachim Barth, Gottfried Beer, Werner Robl, Mathias Vaupel |
2012-12-18 |
| 8330273 |
Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip |
Markus Brunnbauer, Jens Pohl |
2012-12-11 |
| 8330274 |
Semiconductor structure and method for making same |
Hans-Joachim Barth, Gottfried Beer, Joern Plagmann, Jens Pohl, Werner Robl +1 more |
2012-12-11 |
| 8148257 |
Semiconductor structure and method for making same |
Hans-Joachim Barth, Gottfried Beer, Joern Plagmann, Jens Pohl, Werner Robl +1 more |
2012-04-03 |
| 8072071 |
Semiconductor device including conductive element |
Jens Pohl, Werner Robl, Markus Brunnbauer, Gottfried Beer |
2011-12-06 |
| 7863088 |
Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound |
Markus Brunnbauer, Jens Pohl |
2011-01-04 |
| 7772105 |
Semiconductor component with plastic housing, and process for producing the same |
Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen, Jens Pohl, Peter Strobel +3 more |
2010-08-10 |
| 7638418 |
Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same |
Michael Bauer, Holger Woerner |
2009-12-29 |
| 7327023 |
Semiconductor component with plastic housing, and process for producing the same |
Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen, Jens Pohl, Peter Strobel +3 more |
2008-02-05 |
| 7319598 |
Electronic component with a housing package |
Horst Theuss |
2008-01-15 |
| 7009288 |
Semiconductor component with electromagnetic shielding device |
Michael Bauer, Christian Birzer, Georg Ernst, Hermann Vilsmeier, Holger Woerner |
2006-03-07 |
