Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8659135 | Semiconductor device stack and method for its production | Michael Bauer, Ulrich Bachmaier, Jens Pohl, Rainer Steiner, Hermann Vllsmeler +2 more | 2014-02-25 |
| 7795712 | Lead frame with non-conductive connective bar | Alvin Wee Beng Tatt, Fuaida Harun, Soon Hock Tong, Yang Hong Heng, Kean Cheong Lee | 2010-09-14 |
| 7772105 | Semiconductor component with plastic housing, and process for producing the same | Ulrich Bachmaier, Michael Bauer, Jens Pohl, Rainer Steiner, Peter Strobel +3 more | 2010-08-10 |
| 7755178 | Base semiconductor component for a semiconductor component stack and method for the production thereof | Jens Pohl | 2010-07-13 |
| 7700956 | Sensor component and panel used for the production thereof | Edward Fuergut, Bernd Goller, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2010-04-20 |
| 7575173 | Smart card, smart card module, and a method for production of a smart card module | Edward Fuergut, Bernd Goller, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2009-08-18 |
| 7566968 | Biosensor with smart card configuration | Michael Bauer, Bernd Goller, Gerald Ofner, Christian Stuempfl, Holger Woerner | 2009-07-28 |
| 7554196 | Plastic package and semiconductor component comprising such a plastic package, and method for its production | Ulrich Bachmaier, Michael Bauer | 2009-06-30 |
| 7524699 | Electronic component and a panel | Edward Fuergut, Bernd Goller, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2009-04-28 |
| 7517722 | Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds | Bernd Goller, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner | 2009-04-14 |
| 7508083 | Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same | Simon Jerebic | 2009-03-24 |
| 7391103 | Electronic module having plug contacts and method for producing it | Edward Fuergut, Bernd Goller, Simon Jerebic, Jens Pohl, Holger Woerner +1 more | 2008-06-24 |
| 7327023 | Semiconductor component with plastic housing, and process for producing the same | Ulrich Bachmaier, Michael Bauer, Jens Pohl, Rainer Steiner, Peter Strobel +3 more | 2008-02-05 |
| 7276783 | Electronic component with a plastic package and method for production | Bernd Goller, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein +1 more | 2007-10-02 |
| 7190059 | Electronic component with a stack of semiconductor chips and a method for producing the electronic component | Holger Woerner | 2007-03-13 |
| 7045881 | Electronic component with shielding and method for its production | Gerald Ofner | 2006-05-16 |
| 6953992 | Electronic component with at least one semiconductor chip and method for its manufacture | Bernd Goller, Gerald Ofner, Christian Stumpfl, Josef Thumbs, Stefan Wein +1 more | 2005-10-11 |
| 6949405 | Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities | — | 2005-09-27 |
| 6902951 | Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device | Bernd Goller, Christian Stuempfl, Stefan Wein, Holger Woerner | 2005-06-07 |
| 6867471 | Universal package for an electronic component with a semiconductor chip and method for producing the universal package | Bernd Goller, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner | 2005-03-15 |
| 6710455 | Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component | Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Christian Stumpfl +1 more | 2004-03-23 |
| 6683374 | Electronic component and process for producing the electronic component | Bernd Goller, Gerald Ofner, Christian Stumpfl, Josef Thumbs, Stefan Wein +1 more | 2004-01-27 |