Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7517722 | Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Wörner | 2009-04-14 |
| 7276783 | Electronic component with a plastic package and method for production | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs +1 more | 2007-10-02 |
| 6953992 | Electronic component with at least one semiconductor chip and method for its manufacture | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stumpfl, Josef Thumbs +1 more | 2005-10-11 |
| 6902951 | Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device | Bernd Goller, Robert-Christian Hagen, Christian Stuempfl, Holger Woerner | 2005-06-07 |
| 6867471 | Universal package for an electronic component with a semiconductor chip and method for producing the universal package | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Wörner | 2005-03-15 |
| 6710455 | Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component | Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Robert-Christian Hagen +1 more | 2004-03-23 |
| 6683374 | Electronic component and process for producing the electronic component | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stumpfl, Josef Thumbs +1 more | 2004-01-27 |