Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651109 | Selective plating of semiconductor package leads | Syahir Abd Hamid, Jagen Krishnan, Mian Mian Lam, Jayaganasan Narayanasamy, Fabian Schnoy +1 more | 2020-05-12 |
| 9881909 | Method for attaching a semiconductor die to a carrier | Michael Bauer, Ludwig Heitzer | 2018-01-30 |
| 9576935 | Method for fabricating a semiconductor package and semiconductor package | Michael Bauer, Ludwig Heitzer | 2017-02-21 |
| 8330260 | Electronic component of VQFN design and method for producing the same | Michael Bauer, Ludwig Heitzer | 2012-12-11 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Horst Theuss +1 more | 2011-05-17 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing | Michael Bauer, Peter Strobel, Jens Pohl, Ludwig Heitzer | 2011-04-05 |
| 7834460 | Method for manufacturing an electronic component and corresponding electronic component | Michael Bauer, Ludwig Heitzer | 2010-11-16 |
| 7749864 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel | 2010-07-06 |
| 7714416 | Electronic circuit in a package-in-package configuration and production method | Michael Bauer, Ludwig Heitzer | 2010-05-11 |
| 7666777 | Electronic structure with components connected by way of solderable connecting elements and method | Michael Bauer, Markus Brunnbauer, Irmgard Escher-Poeppel, Jens Pohl | 2010-02-23 |
| 7662664 | Electronic circuit in a package-on-package configuration and method for producing the same | Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel | 2010-02-16 |
| 7592236 | Method for applying a structure of joining material to the back surfaces of semiconductor chips | Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel | 2009-09-22 |
| 7566968 | Biosensor with smart card configuration | Michael Bauer, Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Holger Woerner | 2009-07-28 |
| 7547645 | Method for coating a structure comprising semiconductor chips | Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel | 2009-06-16 |
| 7517722 | Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Stefan Wein, Holger Wörner | 2009-04-14 |
| 7456495 | Semiconductor module with a semiconductor stack, and methods for its production | Jens Pohl, Bernd Roemer, Bernhard Schaetzler, Herman Vilsmeier, Holger Woerner +1 more | 2008-11-25 |
| 7294916 | Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip | Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel | 2007-11-13 |
| 7276783 | Electronic component with a plastic package and method for production | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Josef Thumbs, Stefan Wein +1 more | 2007-10-02 |
| 6902951 | Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device | Bernd Goller, Robert-Christian Hagen, Stefan Wein, Holger Woerner | 2005-06-07 |
| 6867471 | Universal package for an electronic component with a semiconductor chip and method for producing the universal package | Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Stefan Wein, Holger Wörner | 2005-03-15 |