Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748801 | Carrier arrangement and method for processing a carrier by generating a crack structure | Gunther Mackh, Adolf Koller, Jochen Mueller | 2020-08-18 |
| 10373871 | Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly | Franco Mariani | 2019-08-06 |
| 9972535 | Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly | Franco Mariani | 2018-05-15 |
| 9911655 | Method of dicing a wafer and semiconductor chip | Bernhard Drummer, Korbinian Kaspar, Gunther Mackh | 2018-03-06 |
| 9601475 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2017-03-21 |
| 9570352 | Method of dicing a wafer and semiconductor chip | Bernhard Drummer, Korbinian Kaspar, Gunther Mackh | 2017-02-14 |
| 9362144 | Article and panel comprising semiconductor chips, casting mold and methods of producing the same | Thorsten Meyer | 2016-06-07 |
| 9293423 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2016-03-22 |
| 9093322 | Semiconductor device | Thorsten Meyer, Recai Sezi | 2015-07-28 |
| 8829663 | Stackable semiconductor package with encapsulant and electrically conductive feed-through | Jens Pohl, Irmgard Escher-Poeppel, Thorsten Meyer | 2014-09-09 |
| 8786105 | Semiconductor device with chip having low-k-layers | Thorsten Meyer, Sven Albers, Christian Geissler, Andreas Wolter, David O'Sullivan +2 more | 2014-07-22 |
| 8779563 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Thorsten Meyer, Stephan Brandl, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2014-07-15 |
| 8742563 | Component and method for producing a component | Thorsten Meyer, Harry Hedler | 2014-06-03 |
| 8617929 | On-Chip RF shields with front side redistribution lines | Hans-Joachim Barth, Thorsten Meyer, Jenei Snezana | 2013-12-31 |
| 8604622 | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device | Thorsten Meyer, Jens Pohl | 2013-12-10 |
| 8587110 | Semiconductor module having a semiconductor chip stack and method | Markus Fink, Hans-Gerd Jetten | 2013-11-19 |
| 8524542 | Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same | Edward Fuergut | 2013-09-03 |
| 8487448 | Method for producing chip packages, and chip package produced in this way | Thorsten Meyer, Harry Hedler | 2013-07-16 |
| 8471393 | Semiconductor component including a semiconductor chip and a passive component | Thorsten Meyer, Bernd Waidhas, Grit Sommer, Thomas Wagner | 2013-06-25 |
| 8431063 | Heat treatment for a panel and apparatus for carrying out the heat treatment method | Gottfried Beer, Edward Fuergut | 2013-04-30 |
| 8394308 | Mold method | Edward Fuergut, Daniel Porwol | 2013-03-12 |
| 8330273 | Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip | Jens Pohl, Rainer Steiner | 2012-12-11 |
| 8309454 | Structure for electrostatic discharge in embedded wafer level packages | Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2012-11-13 |
| 8247897 | Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same | Edward Fuergut | 2012-08-21 |
| 8217504 | Article and panel comprising semiconductor chips, casting mold and methods of producing the same | Thorsten Meyer | 2012-07-10 |