Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Andreas Wolter, Marc Dittes +1 more | 2024-04-09 |
| 11424209 | Wafer level package structure with internal conductive layer | Klaus Reingruber, Georg Seidemann, Christian Geissler, Richard Patten | 2022-08-23 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Andreas Wolter, Marc Dittes +1 more | 2022-02-01 |
| 10854590 | Semiconductor die package with more than one hanging die | Klaus Reingruber, Richard Patten, Georg Seidemann, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10741486 | Electronic components having three-dimensional capacitors in a metallization stack | Klaus Reingruber, Christian Geissler | 2020-08-11 |
| 10672731 | Wafer level package structure with internal conductive layer | Klaus Reingruber, Georg Seidemann, Christian Geissler, Richard Patten | 2020-06-02 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |
| 10522485 | Electrical device and a method for forming an electrical device | Christian Geissler, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-12-31 |
| 10522454 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Christian Geissler | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Christian Geissler, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-11-26 |
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Christian Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann +2 more | 2019-09-10 |
| 10403609 | System-in-package devices and methods for forming system-in-package devices | Christian Geissler, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-09-03 |
| 10373844 | Integrated circuit package configurations to reduce stiffness | Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2019-08-06 |
| 10228725 | Flexible band wearable electronic device | Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler, Thorsten Meyer +1 more | 2019-03-12 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2019-02-19 |
| 10128205 | Embedded die flip-chip package assembly | Thorsten Meyer | 2018-11-13 |
| 10121726 | Cooler for semiconductor devices | Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler, Alexandra Atzesdorfer +1 more | 2018-11-06 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2018-10-30 |
| 9997444 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Christian Geissler | 2018-06-12 |
| 9985005 | Chip package-in-package | Thorsten Meyer, Andreas Wolter | 2018-05-29 |
| 9921694 | Wearable computing device | Klaus Reingruber, Teodora Ossiander, Andreas Wolter, Sonja Koller, Georg Seidemann +3 more | 2018-03-20 |
| 9888577 | Passive electrical devices with a polymer carrier | Thorsten Meyer, Gerald Ofner, Reinhard Mahnkopf | 2018-02-06 |
| 9865387 | Electronic package with coil formed on core | Klaus Reingruber, Andreas Wolter | 2018-01-09 |
| 9818672 | Flow diversion devices | Michael P. Skinner, Harald Gossner, Peter Baumgartner, Hans-Joachim Barth | 2017-11-14 |