Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396038 | Flexible packaging architecture | Bok Eng Cheah, Jackson Chung Peng Kong, Shanggar Periaman, Yen Hsiang Chew, Kheng Tat MAR +2 more | 2019-08-27 |
| 9818672 | Flow diversion devices | Sven Albers, Harald Gossner, Peter Baumgartner, Hans-Joachim Barth | 2017-11-14 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Jiamiao Tang, Junfeng Zhao, Yong She, Jiun Hann Sir, Bok Eng Cheah +3 more | 2017-10-03 |
| 9646953 | Integrated circuit packaging techniques and configurations for small form-factor or wearable devices | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi, Shanggar Periaman | 2017-05-09 |
| 9601468 | Magnetic contacts | Teodora Ossiander, Sven Albers, Georg Seidemann | 2017-03-21 |
| 9515049 | Flexibly-wrapped integrated circuit die | Sven Albers, Hans-Joachim Barth, Peter Baumgartner, Harald Gossner | 2016-12-06 |
| 9343389 | Magnetic contacts | Teodora Ossiander, Sven Albers, Georg Seidemann | 2016-05-17 |
| 9209143 | Die edge side connection | Georg Seidemann, Sven Albers, Teodora Ossiander, Hans-Joachim Barth, Harald Gossner +3 more | 2015-12-08 |
| 9142475 | Magnetic contacts | Teodora Ossiander, Sven Albers, Georg Seidemann | 2015-09-22 |
| 7305019 | Excimer laser with electron emitters | Martha Neustadt | 2007-12-04 |
| 6934455 | Waveguides with optical monitoring | Bidhan Chaudhuri, Chan H. Yoo, Mahmood Toofan, Gabel Chong, Achintya Bhowmik | 2005-08-23 |
| 6548224 | Wiring substrate features having controlled sidewall profiles | Ted Chen | 2003-04-15 |
| 6323435 | Low-impedance high-density deposited-on-laminate structures having reduced stress | Jan Strandberg, David Chazan | 2001-11-27 |
| 6165892 | Method of planarizing thin film layers deposited over a common circuit base | David Chazan, Ted Chen, Todd Kaplan, James L. Lykins, Jan Strandberg | 2000-12-26 |