| 10396038 |
Flexible packaging architecture |
Bok Eng Cheah, Jackson Chung Peng Kong, Shanggar Periaman, Yen Hsiang Chew, Kheng Tat MAR +2 more |
2019-08-27 |
| 9818672 |
Flow diversion devices |
Sven Albers, Harald Gossner, Peter Baumgartner, Hans-Joachim Barth |
2017-11-14 |
| 9778688 |
Flexible system-in-package solutions for wearable devices |
Jiamiao Tang, Junfeng Zhao, Yong She, Jiun Hann Sir, Bok Eng Cheah +3 more |
2017-10-03 |
| 9646953 |
Integrated circuit packaging techniques and configurations for small form-factor or wearable devices |
Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi, Shanggar Periaman |
2017-05-09 |
| 9601468 |
Magnetic contacts |
Teodora Ossiander, Sven Albers, Georg Seidemann |
2017-03-21 |
| 9515049 |
Flexibly-wrapped integrated circuit die |
Sven Albers, Hans-Joachim Barth, Peter Baumgartner, Harald Gossner |
2016-12-06 |
| 9343389 |
Magnetic contacts |
Teodora Ossiander, Sven Albers, Georg Seidemann |
2016-05-17 |
| 9209143 |
Die edge side connection |
Georg Seidemann, Sven Albers, Teodora Ossiander, Hans-Joachim Barth, Harald Gossner +3 more |
2015-12-08 |
| 9142475 |
Magnetic contacts |
Teodora Ossiander, Sven Albers, Georg Seidemann |
2015-09-22 |
| 7305019 |
Excimer laser with electron emitters |
Martha Neustadt |
2007-12-04 |
| 6934455 |
Waveguides with optical monitoring |
Bidhan Chaudhuri, Chan H. Yoo, Mahmood Toofan, Gabel Chong, Achintya Bhowmik |
2005-08-23 |
| 6548224 |
Wiring substrate features having controlled sidewall profiles |
Ted Chen |
2003-04-15 |
| 6323435 |
Low-impedance high-density deposited-on-laminate structures having reduced stress |
Jan Strandberg, David Chazan |
2001-11-27 |
| 6165892 |
Method of planarizing thin film layers deposited over a common circuit base |
David Chazan, Ted Chen, Todd Kaplan, James L. Lykins, Jan Strandberg |
2000-12-26 |