Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2025-08-26 |
| 11929295 | Multi-use package architecture | Eng Huat Goh, Min Suet Lim, Richard C. Stamey, Chu Aun Lim, Jimin Yao | 2024-03-12 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |
| 11823994 | Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Eng Huat Goh, Min Suet Lim | 2023-11-21 |
| 11699644 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Eng Huat Goh, Poh Boon Khoo | 2023-07-11 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2023-05-23 |
| 11658127 | RFI free picture frame metal stiffener | Eng Huat Goh, Khang Choong Yong, Boon Ping Koh, Wil Choon Song, Min Suet Lim | 2023-05-23 |
| 11587844 | Electronic device package on package (POP) | Eng Huat Goh, Min Suet Lim, Xi Guo | 2023-02-21 |
| 11538633 | Combination stiffener and capacitor | Eng Huat Goh, Min Suet Lim | 2022-12-27 |
| 11393760 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Eng Huat Goh, Khang Choong Yong, Min Suet Lim, Wil Choon Song | 2022-07-19 |
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Poh Boon Khoo, Eng Huat Goh | 2022-05-03 |
| 11289414 | Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Eng Huat Goh, Min Suet Lim | 2022-03-29 |
| 11264315 | Electronic package with passive component between substrates | Eng Huat Goh, Min Suet Lim, Hoay Tien Teoh, Jimmy Huang | 2022-03-01 |
| 11264160 | Extended package air core inductor | Eng Huat Goh, Min Suet Lim, Chin Lee Kuan, Siew Fong Yap | 2022-03-01 |
| 11205613 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Eng Huat Goh, Poh Boon Khoo | 2021-12-21 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2021-05-04 |
| 10923415 | Semiconductor package having integrated stiffener region | Eng Huat Goh, Min Suet Lim, Shawna M. Liff, Feras Eid | 2021-02-16 |
| 10796999 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Eng Huat Goh, Khang Choong Yong, Min Suet Lim, Wil Choon Song | 2020-10-06 |
| 10609813 | Capacitive interconnect in a semiconductor package | Eng Huat Goh, Min Suet Lim, Fern Nee Tan, Khang Choong Yong | 2020-03-31 |
| 10515912 | Integrated circuit packages | Min Suet Lim, Eng Huat Eh Goh, Mooi Ling Chang | 2019-12-24 |
| 10256213 | Reduced-height electronic memory system and method | Eng Huat Goh, Min Suet Lim | 2019-04-09 |
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go +1 more | 2018-12-25 |
| 9972589 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Eng Huat Goh, Min Suet Lim, Seok Ling Lim, Hoay Tien Teoh | 2018-05-15 |
| 9960224 | Three capacitor stack and associated methods | Eng Huat Goh, Han Kung Chua, Min Suet Lim, Hoay Tien Teoh | 2018-05-01 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Bok Eng Cheah +3 more | 2017-10-03 |