Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2025-08-26 |
| 12336196 | Magnetic core inductors on package substrates | Krishna Bharath, Wei-Lun Kane Jen, Huong Do | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2025-06-10 |
| 12272650 | Microelectronic package with substrate cavity for bridge-attach | Omkar G. Karhade, Debendra Mallik, Nitin A. Deshpande | 2025-04-08 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2024-07-23 |
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng | 2024-04-09 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11923257 | Hybrid microelectronic substrates | Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey | 2024-03-05 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2024-02-20 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2024-02-06 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2023-09-19 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Yikang Deng +1 more | 2023-07-18 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Kaladhar Radhakrishnan, Huong Do, William J. Lambert | 2023-06-13 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2023-05-23 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Islam A. Salama, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11552019 | Substrate patch reconstitution options | Haifa Hariri, Wei-Lun Kane Jen, Islam A. Salama | 2023-01-10 |
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Ji-Yong Park, Siddharth K. Alur, Cheng Xu | 2022-11-22 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2022-08-30 |
| 11404364 | Multi-layer embedded magnetic inductor coil | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng | 2022-08-02 |
| 11393751 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng | 2022-07-19 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Yikang Deng +1 more | 2022-05-10 |
| 11272619 | Apparatus with embedded fine line space in a cavity, and a method for forming the same | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Ji-Yong Park, Maroun D. Moussallem +2 more | 2022-03-08 |