| 12469820 |
Fine-grained disaggregated server architecture |
Carleton L. Molnar, Adel A. Elsherbini, Tanay Karnik, Shawna M. Liff, Robert J. Munoz +6 more |
2025-11-11 |
|
| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
Adel A. Elsherbini, William J. Lambert, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more |
2025-09-02 |
|
| 12381029 |
Stepped coax MIL PTHS for modulating inductance within a package |
Brandon C. Marin, Haifa Hariri, Tarek A. Ibrahim |
2025-08-05 |
|
| 12342454 |
Computing system with cooling for controlling temperature of electronic components |
Unnikrishnan Vadakkanmaru Veedu, Silvia Anali Soto De La Torre, Alexander Lyakhov, Fenghua Shen, Madhavi Tadepalli |
2025-06-24 |
|
| 12336196 |
Magnetic core inductors on package substrates |
Wei-Lun Kane Jen, Huong Do, Amruthavalli Pallavi Alur |
2025-06-17 |
|
| 12308362 |
Packaging architecture for disaggregated integrated voltage regulators |
Kaladhar Radhakrishnan, William J. Lambert, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef |
2025-05-20 |
|
| 12288750 |
Conformal power delivery structure for direct chip attach architectures |
William J. Lambert, Beomseok Choi, Kaladhar Radhakrishnan, Adel A. Elsherbini |
2025-04-29 |
|
| 12242290 |
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
Beomseok Choi, William J. Lambert, Kaladhar Radhakrishnan, Adel A. Elsherbini, Henning Braunisch +3 more |
2025-03-04 |
|
| 12224252 |
Magnetic core inductors in interposer |
William J. Lambert, Haifa Hariri, Siddharth Kulasekaran, Mathew J. Manusharow, Anne Augustine |
2025-02-11 |
|
| 12199018 |
Direct bonding in microelectronic assemblies |
Adel A. Elsherbini, Han Wui Then, Kimin Jun, Aleksandar Aleksov, Mohammad Enamul Kabir +3 more |
2025-01-14 |
|
| 12154710 |
Package embedded magnetic power transformers for SMPS |
Anuj Modi, Huong Do, William J. Lambert, Harish Krishnamurthy |
2024-11-26 |
$26,820,000 |
| 12087682 |
Power delivery structures |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch +2 more |
2024-09-10 |
$16,964,000 |
| 12068684 |
Multi-phase switching regulators with hybrid inductors and per phase frequency control |
Christopher Schaef, William J. Lambert, Kaladhar Radhakrishnan |
2024-08-20 |
$20,163,000 |
| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Kevin P. O'Brien, Kimin Jun, Han Wui Then, Mohammad Enamul Kabir +5 more |
2024-08-13 |
$26,861,000 |
| 12002745 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more |
2024-06-04 |
$24,500,000 |
| 11955426 |
Package-integrated multi-turn coil embedded in a package magnetic core |
Huong Do, Kaladhar Radhakrishnan, Yikang Deng, Amruthavalli Pallavi Alur |
2024-04-09 |
$27,197,000 |
| 11916006 |
Microelectronic assemblies having an integrated voltage regulator chiplet |
Adel A. Elsherbini, Kaladhar Radhakrishnan, Shawna M. Liff, Johanna M. Swan |
2024-02-27 |
$28,450,000 |
| 11881457 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Javier Soto Gonzalez +1 more |
2024-01-23 |
|
| 11791528 |
Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line |
Adel A. Elsherbini, Mathew J. Manusharow, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more |
2023-10-17 |
$15,641,000 |
| 11735535 |
Coaxial magnetic inductors with pre-fabricated ferrite cores |
Kaladhar Radhakrishnan, Clive R. Hendricks |
2023-08-22 |
$16,803,000 |
| 11688729 |
Integrated thin film capacitors on a glass core substrate |
Adel A. Elsherbini, Mathew J. Manusharow |
2023-06-27 |
$18,721,000 |
| 11676950 |
Via-in-via structure for high density package integrated inductor |
Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do, William J. Lambert |
2023-06-13 |
$22,204,000 |
| 11538617 |
Integrated magnetic core inductors on glass core substrates |
Adel A. Elsherbini |
2022-12-27 |
$12,365,000 |
| 11527483 |
Package including fully integrated voltage regulator circuitry within a substrate |
Chong Zhang |
2022-12-13 |
$11,573,000 |
| 11462463 |
Microelectronic assemblies having an integrated voltage regulator chiplet |
Adel A. Elsherbini, Kaladhar Radhakrishnan, Shawna M. Liff, Johanna M. Swan |
2022-10-04 |
$13,460,000 |
