Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more | 2025-09-02 |
| 12381029 | Stepped coax MIL PTHS for modulating inductance within a package | Brandon C. Marin, Haifa Hariri, Tarek A. Ibrahim | 2025-08-05 |
| 12342454 | Computing system with cooling for controlling temperature of electronic components | Unnikrishnan Vadakkanmaru Veedu, Silvia Anali Soto De La Torre, Alexander Lyakhov, Fenghua Shen, Madhavi Tadepalli | 2025-06-24 |
| 12336196 | Magnetic core inductors on package substrates | Wei-Lun Kane Jen, Huong Do, Amruthavalli Pallavi Alur | 2025-06-17 |
| 12308362 | Packaging architecture for disaggregated integrated voltage regulators | Kaladhar Radhakrishnan, William J. Lambert, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef | 2025-05-20 |
| 12288750 | Conformal power delivery structure for direct chip attach architectures | William J. Lambert, Beomseok Choi, Kaladhar Radhakrishnan, Adel A. Elsherbini | 2025-04-29 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Kaladhar Radhakrishnan, Adel A. Elsherbini, Henning Braunisch +3 more | 2025-03-04 |
| 12224252 | Magnetic core inductors in interposer | William J. Lambert, Haifa Hariri, Siddharth Kulasekaran, Mathew J. Manusharow, Anne Augustine | 2025-02-11 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Han Wui Then, Kimin Jun, Aleksandar Aleksov, Mohammad Enamul Kabir +3 more | 2025-01-14 |
| 12154710 | Package embedded magnetic power transformers for SMPS | Anuj Modi, Huong Do, William J. Lambert, Harish Krishnamurthy | 2024-11-26 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch +2 more | 2024-09-10 |
| 12068684 | Multi-phase switching regulators with hybrid inductors and per phase frequency control | Christopher Schaef, William J. Lambert, Kaladhar Radhakrishnan | 2024-08-20 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Kevin P. O'Brien, Kimin Jun, Han Wui Then, Mohammad Enamul Kabir +5 more | 2024-08-13 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Yikang Deng, Amruthavalli Pallavi Alur | 2024-04-09 |
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11735535 | Coaxial magnetic inductors with pre-fabricated ferrite cores | Kaladhar Radhakrishnan, Clive R. Hendricks | 2023-08-22 |
| 11688729 | Integrated thin film capacitors on a glass core substrate | Adel A. Elsherbini, Mathew J. Manusharow | 2023-06-27 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do, William J. Lambert | 2023-06-13 |
| 11538617 | Integrated magnetic core inductors on glass core substrates | Adel A. Elsherbini | 2022-12-27 |
| 11527483 | Package including fully integrated voltage regulator circuitry within a substrate | Chong Zhang | 2022-12-13 |
| 11462463 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Shawna M. Liff, Johanna M. Swan | 2022-10-04 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Adel A. Elsherbini, Shawna M. Liff, Kaladhar Radhakrishnan, Zhiguo Qian, Johanna M. Swan | 2022-09-20 |