| 12500207 |
Packaging architecture with intermediate routing layers |
Adel A. Elsherbini, Christopher M. Pelto, Georgios Dogiamis, Bradley A. Jackson, Shawna M. Liff +1 more |
2025-12-16 |
|
| 12469630 |
Inductor and transformer semiconductor devices using hybrid bonding technology |
Georgios Dogiamis, Qiang Yu, Adel A. Elsherbini |
2025-11-11 |
|
| 12463180 |
Monolithic chip stacking using a die with double-sided interconnect layers |
Anup Pancholi |
2025-11-04 |
|
| 12456702 |
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets |
Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +1 more |
2025-10-28 |
|
| 12417978 |
Microelectronic assemblies having backside die-to-package interconnects |
Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Han Wui Then |
2025-09-16 |
|
| 12406956 |
Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers |
Abhishek A. Sharma, Van H. Le, Wilfred Gomes, Hui Jae Yoo |
2025-09-02 |
|
| 12375060 |
Digitally controlled lithographically-defined multi-frequency acoustic resonators |
Ved Gund, Kevin P. O'Brien, Edris M. Mohammed, Arnab Sen Gupta, Matthew V. Metz +2 more |
2025-07-29 |
|
| 12362325 |
Monolithic chip stacking using a die with double-sided interconnect layers |
Anup Pancholi |
2025-07-15 |
|
| 12300579 |
Liquid cooled interposer for integrated circuit stack |
Georgios Dogiamis, Qiang Yu, Feras Eid, Adel A. Elsherbini, Johanna M. Swan +1 more |
2025-05-13 |
|
| 12288810 |
Backside contact structures and fabrication for metal on both sides of devices |
Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak |
2025-04-29 |
|
| 12266682 |
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Shawna M. Liff +3 more |
2025-04-01 |
|
| 12266570 |
Self-aligned interconnect structures and methods of fabrication |
Souvik Ghosh, Willy Rachmady, Ashish Agrawal, Siddharth Chouksey, Jessica M. Torres +5 more |
2025-04-01 |
|
| 12199018 |
Direct bonding in microelectronic assemblies |
Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Aleksandar Aleksov, Mohammad Enamul Kabir +3 more |
2025-01-14 |
|
| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2024-12-24 |
$17,261,000 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more |
2024-10-01 |
$20,560,000 |
| 12100762 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
$33,787,000 |
| 12100761 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
$33,787,000 |
| 12062631 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Han Wui Then, Mohammad Enamul Kabir +5 more |
2024-08-13 |
$26,861,000 |
| 11996404 |
Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material |
Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Willy Rachmady, Zachary Geiger +5 more |
2024-05-28 |
$30,739,000 |
| 11935933 |
Backside contact structures and fabrication for metal on both sides of devices |
Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak |
2024-03-19 |
$28,784,000 |
| 11869894 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more |
2024-01-09 |
$30,329,000 |
| 11854894 |
Integrated circuit device structures and double-sided electrical testing |
Valluri Rao, Patrick Morrow, Rishabh Mehandru, Doug B. Ingerly, Kevin P. O'Brien +3 more |
2023-12-26 |
$39,948,000 |
| 11784165 |
Monolithic chip stacking using a die with double-sided interconnect layers |
Anup Pancholi |
2023-10-10 |
$20,947,000 |
| 11721649 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Brennen Mueller, Shawna M. Liff +2 more |
2023-08-08 |
$22,376,000 |
| 11676966 |
Stacked transistors having device strata with different channel widths |
Gilbert Dewey, Jack T. Kavalieros, Willy Rachmady, Cheng-Ying Huang, Matthew V. Metz +4 more |
2023-06-13 |
$22,204,000 |
