Issued Patents All Time
Showing 25 most recent of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417978 | Microelectronic assemblies having backside die-to-package interconnects | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Han Wui Then | 2025-09-16 |
| 12406956 | Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers | Abhishek A. Sharma, Van H. Le, Wilfred Gomes, Hui Jae Yoo | 2025-09-02 |
| 12375060 | Digitally controlled lithographically-defined multi-frequency acoustic resonators | Ved Gund, Kevin P. O'Brien, Edris M. Mohammed, Arnab Sen Gupta, Matthew V. Metz +2 more | 2025-07-29 |
| 12362325 | Monolithic chip stacking using a die with double-sided interconnect layers | Anup Pancholi | 2025-07-15 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Feras Eid, Adel A. Elsherbini, Johanna M. Swan +1 more | 2025-05-13 |
| 12288810 | Backside contact structures and fabrication for metal on both sides of devices | Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak | 2025-04-29 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Shawna M. Liff +3 more | 2025-04-01 |
| 12266570 | Self-aligned interconnect structures and methods of fabrication | Souvik Ghosh, Willy Rachmady, Ashish Agrawal, Siddharth Chouksey, Jessica M. Torres +5 more | 2025-04-01 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Aleksandar Aleksov, Mohammad Enamul Kabir +3 more | 2025-01-14 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more | 2024-12-24 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12100762 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Il-Seok Son, Donald W. Nelson | 2024-09-24 |
| 12100761 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Il-Seok Son, Donald W. Nelson | 2024-09-24 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Han Wui Then, Mohammad Enamul Kabir +5 more | 2024-08-13 |
| 11996404 | Three-dimensional integrated circuits (3DICs) including bottom gate MOS transistors with monocrystalline channel material | Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Willy Rachmady, Zachary Geiger +5 more | 2024-05-28 |
| 11935933 | Backside contact structures and fabrication for metal on both sides of devices | Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak | 2024-03-19 |
| 11869894 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2024-01-09 |
| 11854894 | Integrated circuit device structures and double-sided electrical testing | Valluri Rao, Patrick Morrow, Rishabh Mehandru, Doug B. Ingerly, Kevin P. O'Brien +3 more | 2023-12-26 |
| 11784165 | Monolithic chip stacking using a die with double-sided interconnect layers | Anup Pancholi | 2023-10-10 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Brennen Mueller, Shawna M. Liff +2 more | 2023-08-08 |
| 11676966 | Stacked transistors having device strata with different channel widths | Gilbert Dewey, Jack T. Kavalieros, Willy Rachmady, Cheng-Ying Huang, Matthew V. Metz +4 more | 2023-06-13 |
| 11658221 | Backside contact structures and fabrication for metal on both sides of devices | Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak | 2023-05-23 |
| 11640961 | III-V source/drain in top NMOS transistors for low temperature stacked transistor contacts | Gilbert Dewey, Ravi Pillarisetty, Jack T. Kavalieros, Aaron D. Lilak, Willy Rachmady +6 more | 2023-05-02 |
| 11605565 | Three dimensional integrated circuits with stacked transistors | Cheng-Ying Huang, Willy Rachmady, Gilbert Dewey, Aaron D. Lilak, Brennen Mueller +5 more | 2023-03-14 |
| 11594452 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Il-Seok Son, Colin T. Carver, Paul B. Fischer, Patrick Morrow | 2023-02-28 |