Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100761 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2024-09-24 |
| 12100762 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2024-09-24 |
| 11594452 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun | 2023-02-28 |
| 11264493 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2022-03-01 |
| 10896847 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun | 2021-01-19 |
| 10797139 | Methods of forming backside self-aligned vias and structures formed thereby | Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Paul B. Fischer | 2020-10-06 |
| 10490449 | Techniques for revealing a backside of an integrated circuit device, and associated configurations | Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun | 2019-11-26 |
| 10367070 | Methods of forming backside self-aligned vias and structures formed thereby | Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Paul B. Fischer | 2019-07-30 |
| 10236282 | Partial layer transfer system and method | Patrick Morrow, Kimin Jun, Rajashree Baskaran, Paul B. Fischer | 2019-03-19 |
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun | 2017-08-01 |
| 9490201 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun | 2016-11-08 |