Il-Seok Son — 11 Patents at Intel

Il-Seok Son has been granted 11 US patents while listed as an inventor at Intel. The first was granted in 2016 and the most recent in September 2024. Il-Seok Son ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Il-Seok Son in Portland, OR, US.

Patents per Year

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Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12100761	Wrap-around source/drain method of making contacts for backside metals	Patrick Morrow, Kimin Jun, Donald W. Nelson	2024-09-24	$33,787,000
12100762	Wrap-around source/drain method of making contacts for backside metals	Patrick Morrow, Kimin Jun, Donald W. Nelson	2024-09-24	$33,787,000
11594452	Techniques for revealing a backside of an integrated circuit device, and associated configurations	Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun	2023-02-28	$10,430,000
11264493	Wrap-around source/drain method of making contacts for backside metals	Patrick Morrow, Kimin Jun, Donald W. Nelson	2022-03-01	$16,941,000
10896847	Techniques for revealing a backside of an integrated circuit device, and associated configurations	Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun	2021-01-19	$115,732,000
10797139	Methods of forming backside self-aligned vias and structures formed thereby	Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Paul B. Fischer	2020-10-06	$29,609,000
10490449	Techniques for revealing a backside of an integrated circuit device, and associated configurations	Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun	2019-11-26	$25,149,000
10367070	Methods of forming backside self-aligned vias and structures formed thereby	Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Paul B. Fischer	2019-07-30	$29,864,000
10236282	Partial layer transfer system and method	Patrick Morrow, Kimin Jun, Rajashree Baskaran, Paul B. Fischer	2019-03-19	$29,538,000
9721898	Methods of forming under device interconnect structures	Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun	2017-08-01	$11,137,000
9490201	Methods of forming under device interconnect structures	Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun	2016-11-08	$9,907,000

Il-Seok Son — 11 Patents

Patents per Year

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