| 12100761 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Kimin Jun, Donald W. Nelson |
2024-09-24 |
| 12100762 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Kimin Jun, Donald W. Nelson |
2024-09-24 |
| 11594452 |
Techniques for revealing a backside of an integrated circuit device, and associated configurations |
Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun |
2023-02-28 |
| 11264493 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Kimin Jun, Donald W. Nelson |
2022-03-01 |
| 10896847 |
Techniques for revealing a backside of an integrated circuit device, and associated configurations |
Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun |
2021-01-19 |
| 10797139 |
Methods of forming backside self-aligned vias and structures formed thereby |
Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Paul B. Fischer |
2020-10-06 |
| 10490449 |
Techniques for revealing a backside of an integrated circuit device, and associated configurations |
Colin T. Carver, Paul B. Fischer, Patrick Morrow, Kimin Jun |
2019-11-26 |
| 10367070 |
Methods of forming backside self-aligned vias and structures formed thereby |
Patrick Morrow, Mauro J. Kobrinsky, Kimin Jun, Paul B. Fischer |
2019-07-30 |
| 10236282 |
Partial layer transfer system and method |
Patrick Morrow, Kimin Jun, Rajashree Baskaran, Paul B. Fischer |
2019-03-19 |
| 9721898 |
Methods of forming under device interconnect structures |
Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun |
2017-08-01 |
| 9490201 |
Methods of forming under device interconnect structures |
Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun |
2016-11-08 |