| 12100762 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Kimin Jun, Il-Seok Son |
2024-09-24 |
$33,787,000 |
| 12100761 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Kimin Jun, Il-Seok Son |
2024-09-24 |
$33,787,000 |
| 11296197 |
Power gate with metal on both sides |
— |
2022-04-05 |
$18,322,000 |
| 11282861 |
Dynamic logic built with stacked transistors sharing a common gate |
Rishabh Mehandru |
2022-03-22 |
$16,833,000 |
| 11264493 |
Wrap-around source/drain method of making contacts for backside metals |
Patrick Morrow, Kimin Jun, Il-Seok Son |
2022-03-01 |
$16,941,000 |
| 11049861 |
Method, device and system to provide capacitance for a dynamic random access memory cell |
Aaron D. Lilak, Patrick Morrow, Rishabh Mehandru, Stephen M. Cea |
2021-06-29 |
$34,663,000 |
| 10892215 |
Metal on both sides with power distributed through the silicon |
Mark Bohr, Patrick Morrow |
2021-01-12 |
$55,416,000 |
| 10700039 |
Silicon die with integrated high voltage devices |
M. Clair Webb, Patrick Morrow, Kimin Jun |
2020-06-30 |
$33,333,000 |
| 10658291 |
Metal on both sides with clock gated-power and signal routing underneath |
Patrick Morrow, Kimin Jun |
2020-05-19 |
$31,576,000 |
| 10578970 |
Ebeam universal cutter |
Yan Borodovsky, Mark C. Phillips |
2020-03-03 |
$18,388,000 |
| 10490542 |
Integrated circuit layout using library cells with alternating conductive lines |
Patrick Morrow, Steven M. Burns |
2019-11-26 |
$25,149,000 |
| 10386722 |
Ebeam staggered beam aperture array |
Yan Borodovsky, Mark C. Phillips |
2019-08-20 |
$17,708,000 |
| 10361090 |
Vertical channel transistors fabrication process by selective subtraction of a regular grid |
Kimin Jun, Patrick Morrow |
2019-07-23 |
$32,139,000 |
| 10332893 |
Architecture to communicate signals for operating a static random access memory |
Eric A. Karl |
2019-06-25 |
$17,766,000 |
| 10325840 |
Metal on both sides with power distributed through the silicon |
Mark Bohr, Patrick Morrow |
2019-06-18 |
$21,210,000 |
| 10297592 |
Monolithic three-dimensional (3D) ICs with local inter-level interconnects |
Patrick Morrow, Kimin Jun, M. Clair Webb |
2019-05-21 |
$20,944,000 |
| 10290528 |
Ebeam align on the fly |
Yan Borodovsky, Mark C. Phillips |
2019-05-14 |
$24,469,000 |
| 10216087 |
Ebeam universal cutter |
Yan Borodovsky, Mark C. Phillips |
2019-02-26 |
$20,644,000 |
| 10186484 |
Metal on both sides with clock gated-power and signal routing underneath |
Patrick Morrow, Kimin Jun |
2019-01-22 |
$27,645,000 |
| 10068874 |
Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) |
M Clair Webb, Patrick Morrow, Kimin Jun |
2018-09-04 |
$19,235,000 |
| 10067416 |
Ebeam three beam aperture array |
Yan Borodovsky, Mark C. Phillips |
2018-09-04 |
$19,235,000 |
| 10014256 |
Unidirectional metal on layer with ebeam |
Yan Borodovsky, Mark C. Phillips |
2018-07-03 |
$24,450,000 |
| 9952511 |
Ebeam non-universal cutter |
Yan Borodovsky, Mark C. Phillips |
2018-04-24 |
$19,097,000 |
| 9897908 |
Ebeam three beam aperture array |
Yan Borodovsky, Mark C. Phillips |
2018-02-20 |
$17,556,000 |
| 9685436 |
Monolithic three-dimensional (3D) ICs with local inter-level interconnects |
Patrick Morrow, Kimin Jun, M. Clair Webb |
2017-06-20 |
$9,273,000 |
