Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100762 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Kimin Jun, Il-Seok Son | 2024-09-24 |
| 12100761 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Kimin Jun, Il-Seok Son | 2024-09-24 |
| 11296197 | Power gate with metal on both sides | — | 2022-04-05 |
| 11282861 | Dynamic logic built with stacked transistors sharing a common gate | Rishabh Mehandru | 2022-03-22 |
| 11264493 | Wrap-around source/drain method of making contacts for backside metals | Patrick Morrow, Kimin Jun, Il-Seok Son | 2022-03-01 |
| 11049861 | Method, device and system to provide capacitance for a dynamic random access memory cell | Aaron D. Lilak, Patrick Morrow, Rishabh Mehandru, Stephen M. Cea | 2021-06-29 |
| 10892215 | Metal on both sides with power distributed through the silicon | Mark Bohr, Patrick Morrow | 2021-01-12 |
| 10700039 | Silicon die with integrated high voltage devices | M. Clair Webb, Patrick Morrow, Kimin Jun | 2020-06-30 |
| 10658291 | Metal on both sides with clock gated-power and signal routing underneath | Patrick Morrow, Kimin Jun | 2020-05-19 |
| 10578970 | Ebeam universal cutter | Yan Borodovsky, Mark C. Phillips | 2020-03-03 |
| 10490542 | Integrated circuit layout using library cells with alternating conductive lines | Patrick Morrow, Steven M. Burns | 2019-11-26 |
| 10386722 | Ebeam staggered beam aperture array | Yan Borodovsky, Mark C. Phillips | 2019-08-20 |
| 10361090 | Vertical channel transistors fabrication process by selective subtraction of a regular grid | Kimin Jun, Patrick Morrow | 2019-07-23 |
| 10332893 | Architecture to communicate signals for operating a static random access memory | Eric A. Karl | 2019-06-25 |
| 10325840 | Metal on both sides with power distributed through the silicon | Mark Bohr, Patrick Morrow | 2019-06-18 |
| 10297592 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, M. Clair Webb | 2019-05-21 |
| 10290528 | Ebeam align on the fly | Yan Borodovsky, Mark C. Phillips | 2019-05-14 |
| 10216087 | Ebeam universal cutter | Yan Borodovsky, Mark C. Phillips | 2019-02-26 |
| 10186484 | Metal on both sides with clock gated-power and signal routing underneath | Patrick Morrow, Kimin Jun | 2019-01-22 |
| 10068874 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | M Clair Webb, Patrick Morrow, Kimin Jun | 2018-09-04 |
| 10067416 | Ebeam three beam aperture array | Yan Borodovsky, Mark C. Phillips | 2018-09-04 |
| 10014256 | Unidirectional metal on layer with ebeam | Yan Borodovsky, Mark C. Phillips | 2018-07-03 |
| 9952511 | Ebeam non-universal cutter | Yan Borodovsky, Mark C. Phillips | 2018-04-24 |
| 9897908 | Ebeam three beam aperture array | Yan Borodovsky, Mark C. Phillips | 2018-02-20 |
| 9685436 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, M. Clair Webb | 2017-06-20 |