Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12067338 | Multi version library cell handling and integrated circuit structures fabricated therefrom | Ranjith Kumar, Quan Shi, Mark Bohr, Andrew W. Yeoh, Sourav Chakravarty +1 more | 2024-08-20 |
| 11271010 | Multi version library cell handling and integrated circuit structures fabricated therefrom | Ranjith Kumar, Quan Shi, Mark Bohr, Andrew W. Yeoh, Sourav Chakravarty +1 more | 2022-03-08 |
| 10700039 | Silicon die with integrated high voltage devices | Donald W. Nelson, Patrick Morrow, Kimin Jun | 2020-06-30 |
| 10297592 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2019-05-21 |
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, Kimin Jun, Il-Seok Son | 2017-08-01 |
| 9685436 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2017-06-20 |
| 9490201 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, Kimin Jun, Il-Seok Son | 2016-11-08 |
| 8860199 | Multi-die processor | Bryan Black, Nicholas Samra | 2014-10-14 |
| 8519462 | 6F2 DRAM cell | Yih Wang, Nick Lindert, Swaminathan Sivakumar, Kevin X. Zhang, Dinesh Somasekhar | 2013-08-27 |