Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10361142 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan | 2019-07-23 | $32,139,000 |
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, M. Clair Webb, Kimin Jun, Il-Seok Son | 2017-08-01 | $11,137,000 |
| 9711428 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan | 2017-07-18 | $6,909,000 |
| 9490201 | Methods of forming under device interconnect structures | Patrick Morrow, M. Clair Webb, Kimin Jun, Il-Seok Son | 2016-11-08 | $9,907,000 |