Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361142 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan | 2019-07-23 |
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, M. Clair Webb, Kimin Jun, Il-Seok Son | 2017-08-01 |
| 9711428 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan | 2017-07-18 |
| 9490201 | Methods of forming under device interconnect structures | Patrick Morrow, M. Clair Webb, Kimin Jun, Il-Seok Son | 2016-11-08 |