Issued Patents All Time
Showing 25 most recent of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424589 | Contiguous shield structures in microelectronic assemblies having hybrid bonding | Beomseok Choi, Adel A. Elsherbini, Han Wui Then, Shawna M. Liff | 2025-09-23 |
| 12424543 | Selective interconnects in back-end-of-line metallization stacks of integrated circuitry | Shawna M. Liff, Adel A. Elsherbini | 2025-09-23 |
| 12417978 | Microelectronic assemblies having backside die-to-package interconnects | Adel A. Elsherbini, Kimin Jun, Shawna M. Liff, Han Wui Then | 2025-09-16 |
| 12412881 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Arun Chandrasekhar | 2025-09-09 |
| 12381182 | Direct bonding in microelectronic assemblies | Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff | 2025-08-05 |
| 12362284 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Gerald Pasdast | 2025-07-15 |
| 12347761 | Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate | Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Veronica Strong | 2025-07-01 |
| 12327795 | Waveguide interconnect bridges | Georgios Dogiamis | 2025-06-10 |
| 12327794 | Die coupling using a substrate with a glass core | Telesphor Kamgaing | 2025-06-10 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Feras Eid, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot | 2025-06-10 |
| 12327827 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Arun Chandrasekhar | 2025-06-10 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-05-27 |
| 12315840 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2025-05-27 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Feras Eid, Adel A. Elsherbini, Kimin Jun +1 more | 2025-05-13 |
| 12300626 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2025-05-13 |
| 12300666 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2025-05-13 |
| 12288751 | Microelectronic assemblies | Aleksandar Aleksov | 2025-04-29 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-04-29 |
| 12265389 | Technologies for providing a cognitive capacity test for autonomous driving | Shahrnaz Azizi, Rajashree Baskaran, Melissa M. Ortiz, Fatema Adenwala, Mengjie Yu | 2025-04-01 |
| 12266840 | Waveguide interconnects for semiconductor packages and related methods | Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff, Beomseok Choi, Qiang Yu | 2025-04-01 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more | 2025-04-01 |
| 12261097 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2025-03-25 |
| 12224261 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Nagatoshi Tsunoda, Jimin Yao | 2025-02-11 |
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Shawna M. Liff | 2025-01-21 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more | 2025-01-14 |