Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327801 | Robust mold integrated substrate | Kyle Yazzie, Shawna M. Liff | 2025-06-10 |
| 12224261 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda | 2025-02-11 |
| 12205915 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Sergio Antonio Chan Arguedas, Chandra Mohan Jha | 2025-01-21 |
| 12003023 | In-package 3D antenna | Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Stephen Andrew Smith +2 more | 2024-06-04 |
| 11929295 | Multi-use package architecture | Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Richard C. Stamey, Chu Aun Lim | 2024-03-12 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang | 2024-01-09 |
| 11735551 | Aligned core balls for interconnect joint stability | Shawna M. Liff, Xin Yan, Numair Ahmed | 2023-08-22 |
| 11735552 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Sergio Antonio Chan Arguedas, Chandra Mohan Jha | 2023-08-22 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong | 2023-02-14 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali +2 more | 2022-07-12 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Shawna M. Liff, William J. Lambert, Zhichao Zhang, Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11322455 | Robust mold integrated substrate | Kyle Yazzie, Shawna M. Liff | 2022-05-03 |
| 11183477 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda | 2021-11-23 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong | 2021-06-29 |
| 10672625 | Electronic device package with recessed substrate for underfill containment | Sergio Antonio Chan Arguedas, Joshua D. Heppner | 2020-06-02 |
| 10504863 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Shawna M. Liff | 2019-12-10 |
| 10297567 | Thermocompression bonding using plasma gas | Donglai Lu, Amrita Mallik, George Kostiew, Shawna M. Liff | 2019-05-21 |
| 10256205 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Shawna M. Liff | 2019-04-09 |
| 10249515 | Electronic device package | Eric J. Li, Shawna M. Liff | 2019-04-02 |
| 9842818 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Shawna M. Liff | 2017-12-12 |
| 9721880 | Integrated circuit package structures | Sanka Ganesan, Shawna M. Liff, Yikang Deng, Debendra Mallik | 2017-08-01 |
| 7705280 | Multispectral plasmonic crystal sensors | Ralph G. Nuzzo, John A. Rogers, Nathan H. Mack, Matthew Stewart, Viktor Malyarchuk | 2010-04-27 |