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Aligned core balls for interconnect joint stability |
Shawna M. Liff, Xin Yan, Numair Ahmed |
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Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong |
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Antenna package using ball attach array to connect antenna and base substrates |
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| 11322455 |
Robust mold integrated substrate |
Kyle Yazzie, Shawna M. Liff |
2022-05-03 |
| 11183477 |
Mixed hybrid bonding structures and methods of forming the same |
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Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
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Sergio Antonio Chan Arguedas, Joshua D. Heppner |
2020-06-02 |
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Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Shawna M. Liff |
2019-12-10 |
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Multispectral plasmonic crystal sensors |
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