| 12327801 |
Robust mold integrated substrate |
Kyle Yazzie, Shawna M. Liff |
2025-06-10 |
|
| 12224261 |
Mixed hybrid bonding structures and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda |
2025-02-11 |
|
| 12205915 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Sergio Antonio Chan Arguedas, Chandra Mohan Jha |
2025-01-21 |
|
| 12003023 |
In-package 3D antenna |
Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Stephen Andrew Smith +2 more |
2024-06-04 |
$24,500,000 |
| 11929295 |
Multi-use package architecture |
Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Richard C. Stamey, Chu Aun Lim |
2024-03-12 |
$37,196,000 |
| 11870163 |
Antenna package using ball attach array to connect antenna and base substrates |
Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang |
2024-01-09 |
$30,329,000 |
| 11735551 |
Aligned core balls for interconnect joint stability |
Shawna M. Liff, Xin Yan, Numair Ahmed |
2023-08-22 |
$16,803,000 |
| 11735552 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Sergio Antonio Chan Arguedas, Chandra Mohan Jha |
2023-08-22 |
$16,803,000 |
| 11581238 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong |
2023-02-14 |
$12,790,000 |
| 11387175 |
Interposer package-on-package (PoP) with solder array thermal contacts |
Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali +2 more |
2022-07-12 |
$13,106,000 |
| 11355849 |
Antenna package using ball attach array to connect antenna and base substrates |
Shawna M. Liff, William J. Lambert, Zhichao Zhang, Robert L. Sankman, Sri Chaitra Jyotsna Chavali |
2022-06-07 |
$12,864,000 |
| 11322455 |
Robust mold integrated substrate |
Kyle Yazzie, Shawna M. Liff |
2022-05-03 |
$16,346,000 |
| 11183477 |
Mixed hybrid bonding structures and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda |
2021-11-23 |
$33,627,000 |
| 11049791 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong |
2021-06-29 |
$34,663,000 |
| 10672625 |
Electronic device package with recessed substrate for underfill containment |
Sergio Antonio Chan Arguedas, Joshua D. Heppner |
2020-06-02 |
$32,838,000 |
| 10504863 |
Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Shawna M. Liff |
2019-12-10 |
$22,400,000 |
| 10297567 |
Thermocompression bonding using plasma gas |
Donglai Lu, Amrita Mallik, George Kostiew, Shawna M. Liff |
2019-05-21 |
$20,944,000 |
| 10256205 |
Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Shawna M. Liff |
2019-04-09 |
$21,845,000 |
| 10249515 |
Electronic device package |
Eric J. Li, Shawna M. Liff |
2019-04-02 |
$26,887,000 |
| 9842818 |
Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Shawna M. Liff |
2017-12-12 |
$18,742,000 |
| 9721880 |
Integrated circuit package structures |
Sanka Ganesan, Shawna M. Liff, Yikang Deng, Debendra Mallik |
2017-08-01 |
$11,137,000 |
| 7705280 |
Multispectral plasmonic crystal sensors |
Ralph G. Nuzzo, John A. Rogers, Nathan H. Mack, Matthew Stewart, Viktor Malyarchuk |
2010-04-27 |
|
