Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297567 | Thermocompression bonding using plasma gas | Donglai Lu, Jimin Yao, Amrita Mallik, Shawna M. Liff | 2019-05-21 |
| 9943931 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach +3 more | 2018-04-17 |
| 9748199 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more | 2017-08-29 |
| 9434029 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach +3 more | 2016-09-06 |
| 9282650 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more | 2016-03-08 |
| 8163598 | Clipless integrated heat spreader process and materials | Raj Bahadur, James Mellody, George Vakanas, Leonel Arana | 2012-04-24 |
| 7892883 | Clipless integrated heat spreader process and materials | Raj Bahadur, James Mellody, George Vakanas, Leonel Arana | 2011-02-22 |
| 7367486 | System and method for forming solder joints | — | 2008-05-06 |