| 12266589 |
Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan |
2025-04-01 |
|
| 12057369 |
Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan |
2024-08-06 |
$17,070,000 |
| 11923268 |
Printed heat spreader structures and methods of providing same |
Jesus Gerardo Reyes Schuldes, Pramod Malatkar, Aravindha R. Antoniswamy, Kyle Arrington |
2024-03-05 |
$29,696,000 |
| 11901262 |
Cooling solution including microchannel arrays and methods of forming the same |
Nicholas Neal, Zhimin Wan, Je-Young Chang |
2024-02-13 |
$18,546,000 |
| 11854931 |
STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die |
Zhimin Wan, Chia-Pin Chiu, Peng Li |
2023-12-26 |
$39,948,000 |
| 11854935 |
Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan |
2023-12-26 |
$39,948,000 |
| 11679407 |
Liquid metal thermal interface material application |
Kyle Arrington, Joseph Petrini, Aaron McCann, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more |
2023-06-20 |
$18,411,000 |
| 11646244 |
Socket loading mechanism for passive or active socket and package cooling |
Steven A. Klein, Zhimin Wan, Chia-Pin Chiu |
2023-05-09 |
$19,706,000 |
| 11581671 |
Integrated circuit package socket housing to enhance package cooling |
Zhimin Wan, Steven A. Klein, Chia-Pin Chiu |
2023-02-14 |
$12,790,000 |
| 11502008 |
Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control |
Nicholas S. Haehn, Edvin Cetegen |
2022-11-15 |
$16,955,000 |
| 11456232 |
Thermal assemblies for multi-chip packages |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Betsegaw K. Gebrehiwot, Chandra Mohan Jha |
2022-09-27 |
$23,391,000 |
| 11444003 |
Integrated heat spreader with multiple channels for multichip packages |
Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha, Weihua Tang |
2022-09-13 |
$14,653,000 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more |
2022-07-26 |
$27,041,000 |
| 11322456 |
Die back side structures for warpage control |
Feras Eid, Venkata Suresh R. Guthikonda, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more |
2022-05-03 |
$16,346,000 |
| 10600699 |
Apparatus for inspection of a package assembly with a thermal solution |
Aastha Uppal, Je-Young Chang, Joseph B. Petrini |
2020-03-24 |
$21,125,000 |
| 10576590 |
Torque controlled driver apparatus and method |
Batsegaw K. Gebrehiwot, Joseph B. Petrini, Nicholas S. Haehn, Robert L. Sankman, Alfredo Cardona |
2020-03-03 |
$18,388,000 |
| 9943931 |
High performance transient uniform cooling solution for thermal compression bonding process |
Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Steven B. Roach, Ioan Sauciuc +3 more |
2018-04-17 |
$23,996,000 |
| 9748199 |
Thermal compression bonding process cooling manifold |
Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, George Kostiew +1 more |
2017-08-29 |
$8,286,000 |
| 9434029 |
High performance transient uniform cooling solution for thermal compression bonding process |
Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Steven B. Roach, Ioan Sauciuc +3 more |
2016-09-06 |
$9,244,000 |
| 9282650 |
Thermal compression bonding process cooling manifold |
Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, George Kostiew +1 more |
2016-03-08 |
$14,558,000 |
| 7341653 |
Method and device for separating particle |
Koichi Hishida, Yohei Sato, Takahiro Yamamoto |
2008-03-11 |
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