Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan | 2025-04-01 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 |
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Pramod Malatkar, Aravindha R. Antoniswamy, Kyle Arrington | 2024-03-05 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Nicholas Neal, Zhimin Wan, Je-Young Chang | 2024-02-13 |
| 11854931 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | Zhimin Wan, Chia-Pin Chiu, Peng Li | 2023-12-26 |
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 |
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Aaron McCann, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more | 2023-06-20 |
| 11646244 | Socket loading mechanism for passive or active socket and package cooling | Steven A. Klein, Zhimin Wan, Chia-Pin Chiu | 2023-05-09 |
| 11581671 | Integrated circuit package socket housing to enhance package cooling | Zhimin Wan, Steven A. Klein, Chia-Pin Chiu | 2023-02-14 |
| 11502008 | Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control | Nicholas S. Haehn, Edvin Cetegen | 2022-11-15 |
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11444003 | Integrated heat spreader with multiple channels for multichip packages | Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha, Weihua Tang | 2022-09-13 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more | 2022-07-26 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |
| 10600699 | Apparatus for inspection of a package assembly with a thermal solution | Aastha Uppal, Je-Young Chang, Joseph B. Petrini | 2020-03-24 |
| 10576590 | Torque controlled driver apparatus and method | Batsegaw K. Gebrehiwot, Joseph B. Petrini, Nicholas S. Haehn, Robert L. Sankman, Alfredo Cardona | 2020-03-03 |
| 9943931 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Steven B. Roach, Ioan Sauciuc +3 more | 2018-04-17 |
| 9748199 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, George Kostiew +1 more | 2017-08-29 |
| 9434029 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Steven B. Roach, Ioan Sauciuc +3 more | 2016-09-06 |
| 9282650 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, George Kostiew +1 more | 2016-03-08 |
| 7341653 | Method and device for separating particle | Koichi Hishida, Yohei Sato, Takahiro Yamamoto | 2008-03-11 |