Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, James C. Matayabas, Jr. +1 more | 2023-06-20 |
| 5838542 | Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage | Darul J. Nelson, James V. Noval, Ricardo E. Suarez | 1998-11-17 |
| 5808875 | Integrated circuit solder-rack interconnect module | John F. McMahon, Frank Kolman | 1998-09-15 |
| 5621613 | Apparatus for dissipating heat in a hinged computing device | Kevin Haley, Hong Xie | 1997-04-15 |
| 5621245 | Apparatus for optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon | Willy Agatstein, Chia-Pin Chiu, Amar Ghori, James R. M. Neal, Gregory Turturio | 1997-04-15 |
| 5556811 | Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon | Willy Agatstein, Chia-Pin Chiu, Amar Ghori, James R. M. Neal, Gregory Turturio | 1996-09-17 |
| 5513070 | Dissipation of heat through keyboard using a heat pipe | Hong Xie, Gregory Turturro, Chia-Pin Chiu | 1996-04-30 |
| 5289337 | Heatspreader for cavity down multi-chip module with flip chip | Mark Palmer | 1994-02-22 |