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Enhanced base die heat path using through-silicon vias |
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Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Nicholas Neal, Zhimin Wan |
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Thermal interface structures for integrated circuit packages |
Kyle Arrington, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy, Joseph B. Petrini |
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Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Nicholas Neal, Zhimin Wan |
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Full package vapor chamber with IHS |
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| 11769753 |
Thermally-optimized tunable stack in cavity package-on-package |
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Liquid metal thermal interface material application |
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