Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Edvin Cetegen, Tannaz Harirchian +1 more | 2023-09-26 |
| 10066303 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Eric Beyne, Joeri De Vos, Jaber Derakhshandeh, Luke England | 2018-09-04 |
| 8426250 | Laser-assisted chemical singulation of a wafer | George Chen, Yuval Greenzweig, Eric J. Li, Sergei Voronov | 2013-04-23 |
| 8173552 | Method of fabricating an identification mark utilizing a liquid film assisted by a laser | Sergei Voronov, Luey Chon Ng, George E. Malouf | 2012-05-08 |
| 8163598 | Clipless integrated heat spreader process and materials | George Kostiew, Raj Bahadur, James Mellody, Leonel Arana | 2012-04-24 |
| 7892883 | Clipless integrated heat spreader process and materials | George Kostiew, Raj Bahadur, James Mellody, Leonel Arana | 2011-02-22 |
| 7446382 | Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates | Paul Winer | 2008-11-04 |
| 6878567 | Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates | Paul Winer | 2005-04-12 |