Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769750 | Substrate, assembly and method for wafer-to-wafer hybrid bonding | Eric Beyne | 2023-09-26 |
| 10170450 | Method for bonding and interconnecting integrated circuit devices | Eric Beyne, Stefaan Van Huylenbroeck | 2019-01-01 |
| 10066303 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Eric Beyne, Jaber Derakhshandeh, Luke England, George Vakanas | 2018-09-04 |
| 8530264 | Methods for manufacturing arrays for CMOS imagers | Koen De Munck, Kiki Minoglou | 2013-09-10 |
| 8493736 | Device for cooling integrated circuits | Herman Oprins, Bart Vandevelde, Paolo Fiorini, Eric Beyne, Bivragh Majeed | 2013-07-23 |