Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810892 | Method of direct bonding semiconductor components | Eric Beyne, Gerald Beyer | 2023-11-07 |
| 11362061 | Method for the electrical bonding of semiconductor components | Lin Hou, Eric Beyne, Ingrid De Wolf, Giovanni Capuz | 2022-06-14 |
| 10066303 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Eric Beyne, Joeri De Vos, Luke England, George Vakanas | 2018-09-04 |
| 9978710 | Method for self-aligned solder reflow bonding and devices obtained thereof | Vikas Dubey, Eric Beyne | 2018-05-22 |